Conference
Reliability of 6-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)
| العنوان: | Reliability of 6-Side Molded Panel-Level Chip-Scale Packages (PLCSPs) |
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| المؤلفون: | Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Fan, Yan-Jun, Cheng, David, Lu, Winnie |
| المصدر: | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ; page 885-894 |
| بيانات النشر: | IEEE |
| سنة النشر: | 2021 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/ectc32696.2021.00148 |
| الاتاحة: | http://dx.doi.org/10.1109/ectc32696.2021.00148 http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501834.pdf?arnumber=9501834 |
| Rights: | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html ; https://doi.org/10.15223/policy-029 ; https://doi.org/10.15223/policy-037 |
| رقم الانضمام: | edsbas.81931896 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/ectc32696.2021.00148 |
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