Conference
Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints
| العنوان: | Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints |
|---|---|
| المؤلفون: | Thekkut, S., Das, R., Njuki, M., Li, J., Sivasubramony, R. S., Alshatnawi, F. W., Moise, M., Greene, C. M., Dimitrov, N. G., Borgesen, P., Shahane, N., Thompson, P., Mirpuri, K. |
| المصدر: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| بيانات النشر: | IEEE |
| سنة النشر: | 2020 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/ectc32862.2020.00084 |
| الاتاحة: | http://dx.doi.org/10.1109/ectc32862.2020.00084 http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159360.pdf?arnumber=9159360 |
| Rights: | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html ; https://doi.org/10.15223/policy-029 ; https://doi.org/10.15223/policy-037 |
| رقم الانضمام: | edsbas.6CC8C1F8 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/ectc32862.2020.00084 |
|---|