Conference
Deposition of barrier layer and CVD copper under no exposed wafer conditions : adhesion performance and process integration
| العنوان: | Deposition of barrier layer and CVD copper under no exposed wafer conditions : adhesion performance and process integration |
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| المؤلفون: | Braeckelmann, G., Manger, D., Seo, S.C., Beasor, S., Nifsten, S., Kaloyeros, A.E. |
| المصدر: | European Workshop Materials for Advanced Metallization, ; page 27-29 |
| بيانات النشر: | IEEE |
| سنة النشر: | 1998 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/mam.1998.887500 |
| الاتاحة: | http://dx.doi.org/10.1109/mam.1998.887500 http://xplorestaging.ieee.org/ielx5/4897/19178/00887500.pdf?arnumber=887500 |
| رقم الانضمام: | edsbas.6C6E2072 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/mam.1998.887500 |
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