Conference
Challenges and solutions for ultra-thin (50 μm) silicon using innovative ZoneBOND™ process
| العنوان: | Challenges and solutions for ultra-thin (50 μm) silicon using innovative ZoneBOND™ process |
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| المؤلفون: | Vial, K., Jouve, A., Rolland, E., Coudrain, P., Aumont, C., Foumel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Hida, R., Ratin, C., Magis, T., Loup, V., Kachtouli, R., Gabette, L., Mourier, T., Laviron, C., Cheramy, S., Sillon, N. |
| المصدر: | 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ; page 445-450 |
| بيانات النشر: | IEEE |
| سنة النشر: | 2012 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/eptc.2012.6507125 |
| الاتاحة: | http://dx.doi.org/10.1109/eptc.2012.6507125 http://xplorestaging.ieee.org/ielx7/6504698/6507037/06507125.pdf?arnumber=6507125 |
| رقم الانضمام: | edsbas.6AEE76AB |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/eptc.2012.6507125 |
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