التفاصيل البيبلوغرافية
| العنوان: |
Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation |
| المؤلفون: |
Liu, D., Chen, X., Yan, Y., Zhang, Z., Jin, Z., Yi, K., Zhang, C., Zheng, Y., Wang, Y., Yang, J., Xu, X., Chen, J., Lu, Y., Wei, D., Wee, A.T.S. |
| المساهمون: |
CENTRE FOR ADVANCED 2D MATERIALS, PHYSICS |
| المصدر: |
Scopus OA2019 |
| بيانات النشر: |
Nature Publishing Group |
| سنة النشر: |
2019 |
| المجموعة: |
National University of Singapore: ScholarBank@NUS |
| الوصف: |
10.1038/s41467-019-09016-0 ; Nature Communications ; 10 ; 1 ; 1188 |
| نوع الوثيقة: |
article in journal/newspaper |
| اللغة: |
unknown |
| تدمد: |
20411723 |
| Relation: |
Liu, D., Chen, X., Yan, Y., Zhang, Z., Jin, Z., Yi, K., Zhang, C., Zheng, Y., Wang, Y., Yang, J., Xu, X., Chen, J., Lu, Y., Wei, D., Wee, A.T.S., Wei, D. (2019). Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation. Nature Communications 10 (1) : 1188. ScholarBank@NUS Repository. https://doi.org/10.1038/s41467-019-09016-0; https://scholarbank.nus.edu.sg/handle/10635/212772 |
| الاتاحة: |
https://scholarbank.nus.edu.sg/handle/10635/212772 |
| Rights: |
Attribution 4.0 International ; https://creativecommons.org/licenses/by/4.0/ |
| رقم الانضمام: |
edsbas.616E8F51 |
| قاعدة البيانات: |
BASE |
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