Academic Journal
Study of the humidity-controlled CeO2 fixed-abrasive chemical mechanical polishing of a single crystal silicon wafer
| العنوان: | Study of the humidity-controlled CeO2 fixed-abrasive chemical mechanical polishing of a single crystal silicon wafer |
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| المؤلفون: | Li, Gengzhuo, Xiao, Chen, Zhang, Shibo, Luo, Shengquan, Chen, Yuhan, Wu, Yongbo |
| المساهمون: | Shenzhen Knowledge Innovation Program, National Natural Science Foundation of China, Science, Technology and Innovation Commission of Shenzhen Municipality |
| المصدر: | Tribology International ; volume 178, page 108087 ; ISSN 0301-679X |
| بيانات النشر: | Elsevier BV |
| سنة النشر: | 2023 |
| المجموعة: | ScienceDirect (Elsevier - Open Access Articles via Crossref) |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| DOI: | 10.1016/j.triboint.2022.108087 |
| الاتاحة: | http://dx.doi.org/10.1016/j.triboint.2022.108087 https://api.elsevier.com/content/article/PII:S0301679X22006582?httpAccept=text/xml https://api.elsevier.com/content/article/PII:S0301679X22006582?httpAccept=text/plain |
| Rights: | https://www.elsevier.com/tdm/userlicense/1.0/ ; https://doi.org/10.15223/policy-017 ; https://doi.org/10.15223/policy-037 ; https://doi.org/10.15223/policy-012 ; https://doi.org/10.15223/policy-029 ; https://doi.org/10.15223/policy-004 |
| رقم الانضمام: | edsbas.5F7ECAF8 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1016/j.triboint.2022.108087 |
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