New types of lead-free solders and their properties

التفاصيل البيبلوغرافية
العنوان: New types of lead-free solders and their properties
المؤلفون: Drapala, J., Petlak, D., Malcharczikova, J., Vodarek, V., Konecna, K., Smetana, B., Zla, S., Kostiukova, G., Seidlerova, J., Lasek, S., Madaj, M., Kroupa, A., Urbanek, J., Dusek, K., Sedlacek, J., Sidorov, V. E.
المصدر: 21st international conference on metallurgy and materials (METAL 2012)
بيانات النشر: TANGER LTD
سنة النشر: 2017
المجموعة: Uralskij Gosudarstvennyj Pedagogicheskij Universitet: Electronic Archive URGPU / Уральский государственный педагогический университет: Электронный архив УРГПУ
مصطلحات موضوعية: LEAD-FREE SOLDERS, TIN ALLOYS, DTA ANALYSIS, MICROSTRUCTURE, CORROSION, ELECTRICAL RESISTIVITY
الوصف: The aim of this work is an experimental study of lead-free solders. Ternary and binary alloys with different ratios of individual elements Ag, Al, Bi, Cu, In, Mg, Sb, Sn and Zn were prepared experimentally. The study of low-fusing solder alloys was performed with the aspect of observing their selected physical, chemical, structural and technological properties. The following characteristics were studied: temperatures and enthalpies of phase transformations (DTA, TG, DSC) of individual solders at the rates of re-heating and cooling of specimens of about 4 degrees C/min, macro-and micro-structural analysis (optical metallography), micro-hardness, chemical analysis: ICP-AES, optical emission spectrometry (OES), X-ray micro-analysis of individual phases in the structure of solders (WDX, EDX), measurement of density and electrical resistivity of selected solders in dependence on the temperature, test of wettability with or without use of fluxes, measurement of corrosion properties.
نوع الوثيقة: conference object
اللغة: English
ردمك: 978-80-87294-31-4
80-87294-31-9
Relation: New types of lead-free solders and their properties / J. Drapala, D. Petlak, J. Malcharczikova [и др.] // 21st international conference on metallurgy and materials (METAL 2012). — 2012. — . — P. 1455-1466.; Jaromir.Drapala@vsb.cz; Kroupa, Ales/A-1162-2014; Dusek, Karel/C-6557-2016; Dusek, Karel/0000-0003-0552-3241; WOS:000318506500226; http://elar.uspu.ru/handle/uspu/5322
الاتاحة: http://elar.uspu.ru/handle/uspu/5322
رقم الانضمام: edsbas.5D726881
قاعدة البيانات: BASE
الوصف
ردمك:9788087294314
8087294319