Conference
Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package
| العنوان: | Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package |
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| المؤلفون: | Chong, Chai Tai, Teck Guan, Lim, Yong, Han, Che, F. X., Ho Soon Wee, David, Chong, Ser Choong |
| المصدر: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| بيانات النشر: | IEEE |
| سنة النشر: | 2020 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/ectc32862.2020.00016 |
| الاتاحة: | http://dx.doi.org/10.1109/ectc32862.2020.00016 http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159293.pdf?arnumber=9159293 |
| Rights: | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html ; https://doi.org/10.15223/policy-029 ; https://doi.org/10.15223/policy-037 |
| رقم الانضمام: | edsbas.53041B9D |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/ectc32862.2020.00016 |
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