Academic Journal
Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects
| العنوان: | Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects |
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| المؤلفون: | Tőkei, Zs., Patz, M., Schmidt, M., Iacopi, F., Demuynck, S., Maex, K. |
| المصدر: | Microelectronic Engineering ; volume 76, issue 1-4, page 70-75 ; ISSN 0167-9317 |
| بيانات النشر: | Elsevier BV |
| سنة النشر: | 2004 |
| المجموعة: | ScienceDirect (Elsevier - Open Access Articles via Crossref) |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| DOI: | 10.1016/j.mee.2004.07.057 |
| الاتاحة: | http://dx.doi.org/10.1016/j.mee.2004.07.057 https://api.elsevier.com/content/article/PII:S016793170400406X?httpAccept=text/xml https://api.elsevier.com/content/article/PII:S016793170400406X?httpAccept=text/plain |
| Rights: | https://www.elsevier.com/tdm/userlicense/1.0/ |
| رقم الانضمام: | edsbas.470E4D9B |
| قاعدة البيانات: | BASE |
| DOI: | 10.1016/j.mee.2004.07.057 |
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