Academic Journal

Highly Sensitive Pressure Sensor Based on Elastic Conductive Microspheres

التفاصيل البيبلوغرافية
العنوان: Highly Sensitive Pressure Sensor Based on Elastic Conductive Microspheres
المؤلفون: Li, Zhangling, Guan, Tong, Zhang, Wuxu, Liu, Jinyun, Xiang, Ziyin, Gao, Zhiyi, He, Jing, Ding, Jun, Bian, Baoru, Yi, Xiaohui, Wu, Yuanzhao, Liu, Yiwei, Shang, Jie, Li, Runwei
المساهمون: Swinburne University of Technology
المصدر: Sensors, Vol. 24, no. 5 (Mar 2024), 1640
بيانات النشر: MDPI AG
سنة النشر: 2024
المجموعة: Swinburne University of Technology: Swinburne Research Bank
الوصف: Elastic pressure sensors play a crucial role in the digital economy, such as in health care systems and human–machine interfacing. However, the low sensitivity of these sensors restricts their further development and wider application prospects. This issue can be resolved by introducing microstructures in flexible pressure-sensitive materials as a common method to improve their sensitivity. However, complex processes limit such strategies. Herein, a cost-effective and simple process was developed for manufacturing surface microstructures of flexible pressure-sensitive films. The strategy involved the combination of MXene–single-walled carbon nanotubes (SWCNT) with mass-produced Polydimethylsiloxane (PDMS) microspheres to form advanced microstructures. Next, the conductive silica gel films with pitted microstructures were obtained through a 3D-printed mold as flexible electrodes, and assembled into flexible resistive pressure sensors. The sensor exhibited a sensitivity reaching 2.6 kPa−1 with a short response time of 56 ms and a detection limit of 5.1 Pa. The sensor also displayed good cyclic stability and time stability, offering promising features for human health monitoring applications.
نوع الوثيقة: article in journal/newspaper
اللغة: unknown
Relation: http://hdl.handle.net/1959.3/477810; https://doi.org/10.3390/s24051640
DOI: 10.3390/s24051640
الاتاحة: http://hdl.handle.net/1959.3/477810
https://doi.org/10.3390/s24051640
Rights: Copyright © 2024
رقم الانضمام: edsbas.44AAF6E3
قاعدة البيانات: BASE