Academic Journal
Nonparametric estimation of SiC film residual stress from the wafer surface profile
| العنوان: | Nonparametric estimation of SiC film residual stress from the wafer surface profile |
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| المؤلفون: | Savchuk, Olga, Volinsky, Alex A. |
| المساهمون: | National Science Foundation, University of San Francisco, Government Council on Grants, Russian Federation |
| المصدر: | Measurement ; volume 177, page 109238 ; ISSN 0263-2241 |
| بيانات النشر: | Elsevier BV |
| سنة النشر: | 2021 |
| المجموعة: | ScienceDirect (Elsevier - Open Access Articles via Crossref) |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| DOI: | 10.1016/j.measurement.2021.109238 |
| الاتاحة: | http://dx.doi.org/10.1016/j.measurement.2021.109238 https://api.elsevier.com/content/article/PII:S0263224121002505?httpAccept=text/xml https://api.elsevier.com/content/article/PII:S0263224121002505?httpAccept=text/plain |
| Rights: | https://www.elsevier.com/tdm/userlicense/1.0/ ; https://doi.org/10.15223/policy-017 ; https://doi.org/10.15223/policy-037 ; https://doi.org/10.15223/policy-012 ; https://doi.org/10.15223/policy-029 ; https://doi.org/10.15223/policy-004 |
| رقم الانضمام: | edsbas.42E28AA2 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1016/j.measurement.2021.109238 |
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