Academic Journal
Performance Improvement for 3.3 kV 1000 A High Power Density Full-SiC Power Modules with Sintered Copper Die Attach
| العنوان: | Performance Improvement for 3.3 kV 1000 A High Power Density Full-SiC Power Modules with Sintered Copper Die Attach |
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| المؤلفون: | Yasui, Kan, Morikawa, Takahiro, Hayakawa, Seiichi, Funaki, Tsuyoshi |
| المصدر: | IEEE Journal of Emerging and Selected Topics in Power Electronics ; page 1-1 ; ISSN 2168-6777 2168-6785 |
| بيانات النشر: | Institute of Electrical and Electronics Engineers (IEEE) |
| سنة النشر: | 2024 |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | unknown |
| DOI: | 10.1109/jestpe.2024.3425722 |
| الاتاحة: | http://dx.doi.org/10.1109/jestpe.2024.3425722 http://xplorestaging.ieee.org/ielx8/6245517/6507303/10589650.pdf?arnumber=10589650 |
| Rights: | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html ; https://doi.org/10.15223/policy-029 ; https://doi.org/10.15223/policy-037 |
| رقم الانضمام: | edsbas.3E641BB2 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/jestpe.2024.3425722 |
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