Conference
Cu matrix composite with carbonized polydopamine as reinforcements
| العنوان: | Cu matrix composite with carbonized polydopamine as reinforcements |
|---|---|
| المؤلفون: | Debiemme-Chouvy, Catherine, Brillon, Alexandre, Lu, Yongfeng, Heintz, Jean-Marc, Silvain, Jean-François |
| المساهمون: | Laboratoire Interfaces et Systèmes Electrochimiques (LISE), Institut de Chimie - CNRS Chimie (INC-CNRS)-Sorbonne Université (SU)-Centre National de la Recherche Scientifique (CNRS), Institut de Chimie de la Matière Condensée de Bordeaux (ICMCB), Université de Bordeaux (UB)-Institut Polytechnique de Bordeaux-Institut de Chimie - CNRS Chimie (INC-CNRS)-Centre National de la Recherche Scientifique (CNRS), Department of Electrical Engineering, University of Nebraska–Lincoln, University of Nebraska System-University of Nebraska System, Graz University of Technology |
| المصدر: | THERMEC‘2023 – International Conference on Processing & Manufacturing of advanced Materials ; https://hal.science/hal-04604493 ; THERMEC‘2023 – International Conference on Processing & Manufacturing of advanced Materials, Graz University of Technology, Jul 2023, Vienne, Austria |
| بيانات النشر: | HAL CCSD |
| سنة النشر: | 2023 |
| مصطلحات موضوعية: | [CHIM.MATE]Chemical Sciences/Material chemistry |
| جغرافية الموضوع: | Vienne, Austria |
| الوصف: | International audience ; The miniaturization of electronic chips induces high power density within electronic assembly. |
| نوع الوثيقة: | conference object |
| اللغة: | English |
| Relation: | hal-04604493; https://hal.science/hal-04604493; https://hal.science/hal-04604493/document; https://hal.science/hal-04604493/file/DebiemmeChouvyC_THERMEC_2023.pdf |
| الاتاحة: | https://hal.science/hal-04604493 https://hal.science/hal-04604493/document https://hal.science/hal-04604493/file/DebiemmeChouvyC_THERMEC_2023.pdf |
| Rights: | info:eu-repo/semantics/OpenAccess |
| رقم الانضمام: | edsbas.394F1B21 |
| قاعدة البيانات: | BASE |
| الوصف غير متاح. |