Academic Journal
A Multiscale Anisotropic Thermal Model of Chiplet Heterogeneous Integration System
| العنوان: | A Multiscale Anisotropic Thermal Model of Chiplet Heterogeneous Integration System |
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| المؤلفون: | Wang, Chenghan, Xu, Qinzhi, Nie, Chuanjun, Cao, He, Liu, Jianyun, Zhang, Daoqing, Li, Zhiqiang |
| المساهمون: | Strategic Priority Research Program (A) of the Chinese Academy of Sciences |
| المصدر: | IEEE Transactions on Very Large Scale Integration (VLSI) Systems ; volume 32, issue 1, page 178-189 ; ISSN 1063-8210 1557-9999 |
| بيانات النشر: | Institute of Electrical and Electronics Engineers (IEEE) |
| سنة النشر: | 2024 |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | unknown |
| DOI: | 10.1109/tvlsi.2023.3321933 |
| الاتاحة: | https://doi.org/10.1109/tvlsi.2023.3321933 http://xplorestaging.ieee.org/ielx7/92/10375851/10287686.pdf?arnumber=10287686 |
| Rights: | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html ; https://doi.org/10.15223/policy-029 ; https://doi.org/10.15223/policy-037 |
| رقم الانضمام: | edsbas.39297596 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/tvlsi.2023.3321933 |
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