Academic Journal

Interfacial-layer-driven dielectric degradation and breakdown of HfSiON/SiON gate dielectric nMOSFETs

التفاصيل البيبلوغرافية
العنوان: Interfacial-layer-driven dielectric degradation and breakdown of HfSiON/SiON gate dielectric nMOSFETs
المؤلفون: Choi, DY, Lee, KT, Baek, CK, Sohn, CW, Sagong, HC, Jung, EY, Lee, JS, Jeong, YH
المساهمون: 창의IT융합공학과, 10644344, Baek, CK, Lee, JS, Jeong, YH
بيانات النشر: IEEE
سنة النشر: 2011
المجموعة: Pohang University of Science and Technology (POSTECH): Open Access System for Information Sharing (OASIS)
مصطلحات موضوعية: HfSiON, high-k dielectric, interfacial layer (IL), positive bias temperature instability (BTI) (PBTI), reliability, SiON, stress-induced leakage current (SILC), time-dependent dielectric breakdown (TDDB)
الوصف: This letter describes the dielectric degradation and breakdown characteristics of HfSiON/SiON gate dielectric nMOSFETs using the stress-induced leakage current (SILC) analysis. The nMOSFETs show progressive breakdown (PBD) under substrate injection stress, and its characteristic changes as the stress voltage increases, from slow PBD (s-PBD) only, then to a combination of s-PBD and fast PBD (f-PBD), and finally to f-PBD only. It is found that the SILC of nMOSFETs is caused by trap-assisted tunneling mainly through the preexisting deep traps of the high-k layer and the stress-induced traps of the interfacial layer (IL). The stress-induced defects under substrate injection stress are generated within the IL rather than the high-k layer, and the time-dependent dielectric breakdown of the nMOSFETs is driven by the degradation of the IL. ; X ; 1 ; 1 ; 6 ; 7 ; scie ; scopus
نوع الوثيقة: article in journal/newspaper
اللغة: English
تدمد: 0741-3106
Relation: IEEE ELECTRON DEVICE LETTERS; 32; 10; 1319; 1321; SCI급, SCOPUS 등재논문; SCI; Engineering, Electrical & Electronic; Engineering; 2011-OAK-0000029380; https://oasis.postech.ac.kr/handle/2014.oak/14742; 12844; IEEE ELECTRON DEVICE LETTERS, v.32, no.10, pp.1319 - 1321; 000295340300001; 2-s2.0-80053565169
DOI: 10.1109/LED.2011.2161861
الاتاحة: https://oasis.postech.ac.kr/handle/2014.oak/14742
https://doi.org/10.1109/LED.2011.2161861
رقم الانضمام: edsbas.3451CC56
قاعدة البيانات: BASE
الوصف
تدمد:07413106
DOI:10.1109/LED.2011.2161861