Conference
Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding
| العنوان: | Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding |
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| المؤلفون: | Inac, M., Wietstruck, M., Goritz, A., Cetindogan, B., Baristiran-Kaynak, C., Lisker, M., Kruger, A., Trusch, A., Saarow, U., Heinrich, P., Voss, T., Kaynak, M. |
| المصدر: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ; page 1-4 |
| بيانات النشر: | IEEE |
| سنة النشر: | 2017 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/eptc.2017.8277523 |
| الاتاحة: | http://dx.doi.org/10.1109/eptc.2017.8277523 http://xplorestaging.ieee.org/ielx7/8267583/8277424/08277523.pdf?arnumber=8277523 |
| رقم الانضمام: | edsbas.3109A9F8 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/eptc.2017.8277523 |
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