التفاصيل البيبلوغرافية
| العنوان: |
Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture |
| المؤلفون: |
Pelto, Christopher, Aggarwal, R., Ahan, R., Armstrong, M., Bebek, M., Blount, M., Chowdhury, S., Chuah, J., Connor, C., DeBonis, T., Dhayal, B., Dougless, A., Gokhale, S., Jain, A., Javvaji, V., Kamisetty, K., Kim, G., Kpetehoto, J., Kuan, C., Lin, C., Liu, G., Ma, Y., Mcpherson, G., Mokler, S., Perini, C., Ramaswamy, R., Sell, B., Subramaniam, R., Waldemer, J., Wei, D., Yang, Y., Yaung, J., Sabi, B., Natarajan, S. |
| المصدر: |
2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ; page 1-2 |
| بيانات النشر: |
IEEE |
| سنة النشر: |
2024 |
| نوع الوثيقة: |
conference object |
| اللغة: |
unknown |
| DOI: |
10.1109/vlsitechnologyandcir46783.2024.10631478 |
| الاتاحة: |
http://dx.doi.org/10.1109/vlsitechnologyandcir46783.2024.10631478
http://xplorestaging.ieee.org/ielx8/10631290/10631310/10631478.pdf?arnumber=10631478 |
| Rights: |
https://doi.org/10.15223/policy-029 ; https://doi.org/10.15223/policy-037 |
| رقم الانضمام: |
edsbas.29C27CA7 |
| قاعدة البيانات: |
BASE |