Performance and Design Considerations for Gate-All-Around Stacked-NanoWires FETs

التفاصيل البيبلوغرافية
العنوان: Performance and Design Considerations for Gate-All-Around Stacked-NanoWires FETs
المؤلفون: Barraud, S., Lapras, V., Previtali, B., Samson, M., Lacord, J., Martinie, S., Jaud, M.-A, Athanasiou, S, Triozon, F., Rozeau, O., Hartmann, J, M, Vizioz, C, Comboroure, C, Andrieu, F, Barbé, J, C, Vinet, M, Ernst, T
المساهمون: Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), STMicroelectronics Crolles (ST-CROLLES), ANR-10-EQPX-0030,FDSOI11,Plateforme FDSOI pour le node 11nm(2010), European Project: 688101,H2020,H2020-ICT-2015,SUPERAID7(2016)
المصدر: 2017 IEEE International Electron Devices Meeting (IEDM)
https://cea.hal.science/cea-01973409
2017 IEEE International Electron Devices Meeting (IEDM), Dec 2017, San Francisco, United States. ⟨10.1109/IEDM.2017.8268473⟩
بيانات النشر: HAL CCSD
سنة النشر: 2017
المجموعة: HAL-CEA (Commissariat à l'énergie atomique et aux énergies alternatives)
مصطلحات موضوعية: [SPI]Engineering Sciences [physics]
جغرافية الموضوع: San Francisco, United States
الوصف: International audience ; This paper presents recent progress on Gate-All-Around (GAA) stacked-NanoWire (NW) / NanoSheet (NS) MOSFETs. Key technological challenges will be discussed and recent research results presented. Width-dependent carrier mobility in Si NW/NS and FinFET will be analyzed, and intrinsic performance and design considerations of GAA structures will be discussed and compared to FinFET devices with a focus on electrostatics, parasitic capacitances and different layout options. The results show that more flexibility can be achieved with stacked-NS transistors in order to manage power-performance optimization.
نوع الوثيقة: conference object
اللغة: English
Relation: info:eu-repo/grantAgreement//688101/EU/Stability Under Process Variability for Advanced Interconnects and Devices Beyond 7 nm node/SUPERAID7; cea-01973409; https://cea.hal.science/cea-01973409; https://cea.hal.science/cea-01973409/document; https://cea.hal.science/cea-01973409/file/6-Barraud_IEDM2017.pdf
DOI: 10.1109/IEDM.2017.8268473
الاتاحة: https://cea.hal.science/cea-01973409
https://cea.hal.science/cea-01973409/document
https://cea.hal.science/cea-01973409/file/6-Barraud_IEDM2017.pdf
https://doi.org/10.1109/IEDM.2017.8268473
Rights: info:eu-repo/semantics/OpenAccess
رقم الانضمام: edsbas.23078B58
قاعدة البيانات: BASE
الوصف
DOI:10.1109/IEDM.2017.8268473