Academic Journal

Picosecond acoustics versus tape adhesion test: Confrontation on a series of similar samples with a variable adhesion

التفاصيل البيبلوغرافية
العنوان: Picosecond acoustics versus tape adhesion test: Confrontation on a series of similar samples with a variable adhesion
المؤلفون: Vital-Juarez, A., Roffi, L., Desmarres, J.-M., Devos, Arnaud
المساهمون: Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN), Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA), Université catholique de Lille (UCL)-Université catholique de Lille (UCL), Centre National d'Études Spatiales Toulouse (CNES), Physique - IEMN (PHYSIQUE - IEMN), Université catholique de Lille (UCL)-Université catholique de Lille (UCL)-Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA), French Space AgencyRégion Hauts de FranceNational Centre for Scientific Research
المصدر: ISSN: 0257-8972.
بيانات النشر: HAL CCSD
Elsevier
سنة النشر: 2022
المجموعة: Université Polytechnique Hauts-de-France: HAL
مصطلحات موضوعية: Adhesion, Thin film, Reflection coefficient, Picosecond acoustics, [SPI.MECA]Engineering Sciences [physics]/Mechanics [physics.med-ph], [SPI.ACOU]Engineering Sciences [physics]/Acoustics [physics.class-ph]
الوصف: International audience ; A large number of methods have been developed to characterize the adhesion of a thin film to a substrate. Among them, tape test is still one of the most popular methods. Acoustic waves and especially ultra-high frequency acoustic waves are also sensitive to adhesion defects as they affect the way acoustic waves are reflected at such an interface. In this work, we first prepare a series of identical thin-film samples with a variable adhesion at the interface between the film and its substrate. To modulate adhesion of some samples, an ultrathin gold layer is deposited on the substrate before thin-film sputtering. Si+ ion implantation is also used to reinforce locally gold adhesion. The samples are then characterized using two much different techniques: picosecond acoustics (PA) for measuring thickness and acoustic reflection coefficient (R) at the interface and tape test to have an independent evaluation of the adhesion through the peeled area (P). On the samples series, R is found to vary from −0.46 the expected value for a perfectly bonded Ni/Si interface to almost −0.83 not far from −1 which corresponds to delamination. An excellent correlation is found between R and P: high |R| value samples are easily peeled off and P is large. That work demonstrates the capability of PA to perform adhesion test in a totally non-destructive manner and furthermore locally.
نوع الوثيقة: article in journal/newspaper
اللغة: English
Relation: hal-03814601; https://hal.science/hal-03814601; https://hal.science/hal-03814601/document; https://hal.science/hal-03814601/file/Devos_preprint%20%28as%20published%29.pdf
DOI: 10.1016/j.surfcoat.2022.128926
الاتاحة: https://hal.science/hal-03814601
https://hal.science/hal-03814601/document
https://hal.science/hal-03814601/file/Devos_preprint%20%28as%20published%29.pdf
https://doi.org/10.1016/j.surfcoat.2022.128926
Rights: info:eu-repo/semantics/OpenAccess
رقم الانضمام: edsbas.1EC8432B
قاعدة البيانات: BASE
الوصف
DOI:10.1016/j.surfcoat.2022.128926