Conference
Frequency trimming of silicon resonators after package with integrated micro-evaporators
| العنوان: | Frequency trimming of silicon resonators after package with integrated micro-evaporators |
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| المؤلفون: | You, Weilong, Yang, Heng, Pei, Binbin, Sun, Ke, Li, Xinxin |
| المصدر: | 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS) |
| بيانات النشر: | IEEE |
| سنة النشر: | 2017 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/memsys.2017.7863558 |
| الاتاحة: | http://dx.doi.org/10.1109/memsys.2017.7863558 http://xplorestaging.ieee.org/ielx7/7852393/7863316/07863558.pdf?arnumber=7863558 |
| رقم الانضمام: | edsbas.1A1858D7 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/memsys.2017.7863558 |
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