Scanning Acoustic Microscopy versus Colored Picosecond Acoustics to detect interface defects in hybrid wafer bonding

التفاصيل البيبلوغرافية
العنوان: Scanning Acoustic Microscopy versus Colored Picosecond Acoustics to detect interface defects in hybrid wafer bonding
المؤلفون: Bossut, Solene, Devos, Arnaud, Lhostis, S, Deloffre, E, Euvrard, C, Dettoni, F, Chaton, C
المساهمون: Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN), Centrale Lille-Institut supérieur de l'électronique et du numérique (ISEN)-Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF), Physique - IEMN (PHYSIQUE - IEMN), Centrale Lille-Institut supérieur de l'électronique et du numérique (ISEN)-Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-Centrale Lille-Institut supérieur de l'électronique et du numérique (ISEN)-Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Laboratoire commun STMicroelectronics-IEMN T3
المصدر: Forum Acusticum ; https://hal.science/hal-03240341 ; Forum Acusticum, Dec 2020, Lyon, France. pp.2553-2554, ⟨10.48465/fa.2020.0878⟩
بيانات النشر: HAL CCSD
سنة النشر: 2020
المجموعة: Université Polytechnique Hauts-de-France: HAL
مصطلحات موضوعية: Hybrid bonding, Scanning Acoustic Microscopy, Picosecond Acoustics, [PHYS.MECA.ACOU]Physics [physics]/Mechanics [physics]/Acoustics [physics.class-ph], [PHYS.MECA.VIBR]Physics [physics]/Mechanics [physics]/Vibrations [physics.class-ph]
جغرافية الموضوع: Lyon, France
الوصف: International audience ; Nowadays, microelectronics is making progress in miniaturization and diversification of chips by 3D integration: dies are stacked together to gain space and performances. The stacking used here is called hybrid bonding [1], as stacked surfaces are heterogeneous: part Cu and part oxide. After the bonding, it exists some defects at the interface which size can be milimetric to nanometric. Acoustic waves are very useful for detecting defects. In the field, the most used technique is the Scanning Acoustic Microscopy (SAM) which makes an image of the interface using ultrasonics (10-1000 MHz) with a XY resolution of 20 μm [2]. To detect smaller defects, Transmission Electron Microscopy (TEM) is used. Its resolution is about 0,1 nm, making this technic very local compared to SAM. Like the SAM, Colored Picosecond Acoustics (APiC) is based on acoustic waves but at higher frequencies (10-500 GHz) using of a femtosecond laser in a pump-probe scheme [3,4]. Such a technique is closer to TEM resolution. In this work, both acoustic techniques (SAM and APiC) are applied to the characterization of the same samples made of bonded wafers. APiC is first used to characterize the stack (thickness, velocity). Then, the interface contributions is focused on: Cu/Cu, Cu/oxide, oxide/oxide. As the technic makes a local measurement (typically 1-2 μm), the process is repeated at different points of the surface to get an interface image comparable to SAM result. In this work will be presented the APiC results obtained on wafers also studied by SAM to compare both approaches, especially about the resolution enhancement ApiC brings. The minimal size of the defects that APiC is able to detect will be explored.
نوع الوثيقة: conference object
اللغة: English
Relation: hal-03240341; https://hal.science/hal-03240341; https://hal.science/hal-03240341/document; https://hal.science/hal-03240341/file/000878.pdf
DOI: 10.48465/fa.2020.0878
الاتاحة: https://hal.science/hal-03240341
https://hal.science/hal-03240341/document
https://hal.science/hal-03240341/file/000878.pdf
https://doi.org/10.48465/fa.2020.0878
Rights: info:eu-repo/semantics/OpenAccess
رقم الانضمام: edsbas.1232A75
قاعدة البيانات: BASE