Controlling the thickness of Josephson tunnel barriers with atomic layer deposition

التفاصيل البيبلوغرافية
العنوان: Controlling the thickness of Josephson tunnel barriers with atomic layer deposition
المؤلفون: Elliot, Alan J., Ma, Chunrui, Lu, Rongtao, Xin, Melisa, Han, Siyuan, Wu, Judy Z., Sakidja, Ridwan, Yu, Haifeng
سنة النشر: 2014
المجموعة: Condensed Matter
مصطلحات موضوعية: Condensed Matter - Superconductivity, Condensed Matter - Materials Science
الوصف: Atomic Layer Deposition (ALD) is a promising technique for producing Josephson junctions (JJs) with lower defect densities for qubit applications. A key problem with using ALD for JJs is the interfacial layer (IL) that develops underneath the tunnel barrier. An IL up to 2 nm forms between ALD Al2O3 and Al. However, the IL thickness is unknown for ALD films less 1 nm. In this work, Nb-Al-ALD-Al2O3-Nb trilayers with tunnel barriers from 0.6 - 1.6 nm were grown in situ. Nb-Al-AlOx-Nb JJs with thermally oxidized tunnel barrier were produced for reference. RN was obtained using a four-point method at 300 K. JC, and its dependence on barrier thickness, was calculated from the Ambegaokar-Baratoff formula. The Al surface was modeled using ab initio molecular dynamics to study the nucleation of Al2O3 on Al. Current voltage characteristics were taken at 4 K to corroborate the room temperature measurements. Together, these results suggest that ALD may be used to grow an ultrathin, uniform tunnel barrier with controllable tunnel resistance and JC, but a thin IL develops during the nucleation stage of ALD growth that may disqualify Al as a suitable wetting layer for ALD JJ based qubits.
Comment: 5 pages, 4 figures, Applied Superconductivity Conference
نوع الوثيقة: Working Paper
URL الوصول: http://arxiv.org/abs/1408.3077
رقم الانضمام: edsarx.1408.3077
قاعدة البيانات: arXiv