Atomic layer deposition of aluminum phosphate using AlMe3, PO(OMe)3 and O2 plasma: film growth and surface reactions

التفاصيل البيبلوغرافية
العنوان: Atomic layer deposition of aluminum phosphate using AlMe3, PO(OMe)3 and O2 plasma: film growth and surface reactions
المؤلفون: Mariadriana Creatore, Wilhelmus M. M. Kessels, Norah Hornsveld
المساهمون: Plasma & Materials Processing, Interfaces in future energy technologies, Atomic scale processing, Processing of low-dimensional nanomaterials, EIRES, EIRES Chem. for Sustainable Energy Systems
المصدر: Journal of Physical Chemistry C, 124(9), 5495-5505. American Chemical Society
سنة النشر: 2020
مصطلحات موضوعية: Phosphorus, Inorganic chemistry, Substrate (chemistry), chemistry.chemical_element, 02 engineering and technology, 010402 general chemistry, 021001 nanoscience & nanotechnology, Mass spectrometry, 01 natural sciences, 0104 chemical sciences, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Atomic layer deposition, General Energy, chemistry, Chemisorption, Atomic ratio, Physical and Theoretical Chemistry, Thin film, 0210 nano-technology, Deposition (law)
الوصف: High purity, uniform, and conformal aluminum phosphate (AlPxOy) thin films were deposited by atomic layer deposition (ALD) between 25 and 300 °C using supercycles consisting of (i) PO(OMe)3 dosing combined with O2 plasma exposure and (ii) AlMe3 dosing followed by O2 plasma exposure. In situ spectroscopic ellipsometry and mass spectrometry were applied to demonstrate the ALD self-limiting behavior and to gain insight into the surface reactions during the precursor and coreactant exposures, respectively. Compared to earlier reported AlPxOy ALD studies using H2O and O3 as coreactants or without using coreactans, the use of an oxygen plasma generally leads to higher growth per cycle values and promotes phosphorus incorporation in the film. Specifically, when using a 1:1 POx:Al2O3 cycle ratio and a substrate temperature of 150 °C, the growth per supercycle is found to be 1.8 Å. The [P]:[Al] atomic ratio for this process is approximately 0.5 (∼AlP0.5O2.9) and can be tailored by changing the ratio between the two cycles or the substrate temperature. In literature reports where the same aluminum precursor was used, the [P]:[Al] atomic ratio was limited to 0.2 or a very high number of phosphorus cycles was needed in order to increase the phosphorus content. Instead, we demonstrate deposition of films with a composition close to AlPO4 by using a 2:1 POx:Al2O3 cycle ratio. The limited incorporation of P in the film is suspected to derive from the steric hindrance of the relatively bulky phosphorus precursor. Mass spectrometry suggests that the PO(OMe)3 precursor chemisorbs on the surface without the release of reaction products into the gas phase, whereas Al(Me)3 already undergoes methyl ligand abstraction upon chemisorption.
وصف الملف: application/pdf
اللغة: English
تدمد: 1932-7447
1932-7455
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::67374ddcfa0a64f66d71fb02e298b007
http://www.scopus.com/inward/record.url?scp=85080926692&partnerID=8YFLogxK
Rights: OPEN
رقم الانضمام: edsair.doi.dedup.....67374ddcfa0a64f66d71fb02e298b007
قاعدة البيانات: OpenAIRE