Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration
| العنوان: | Microstructure evolution of innovative thermal bridge composite (i-TBC) for power electronics during elaboration |
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| المؤلفون: | Hiba Fekiri, Alain Köster, Vincent Maurel, Vladimir A. Esin, Yves Bienvenu |
| المساهمون: | Centre des Matériaux (MAT), MINES ParisTech - École nationale supérieure des mines de Paris, Université Paris sciences et lettres (PSL)-Université Paris sciences et lettres (PSL)-Centre National de la Recherche Scientifique (CNRS) |
| المصدر: | Materials and Design Materials and Design, Elsevier, 2018, 137, pp.68-78. ⟨10.1016/j.matdes.2017.10.009⟩ Materials & Design, Vol 137, Iss, Pp 68-78 (2018) |
| بيانات النشر: | Elsevier BV, 2018. |
| سنة النشر: | 2018 |
| مصطلحات موضوعية: | Materials science, Composite number, chemistry.chemical_element, 02 engineering and technology, Welding, 01 natural sciences, Thermal expansion, law.invention, Thermal bridge, law, 0103 physical sciences, lcsh:TA401-492, General Materials Science, Composite material, ComputingMilieux_MISCELLANEOUS, 010302 applied physics, Mechanical Engineering, Metallurgy, Recrystallization (metallurgy), Strain hardening exponent, 021001 nanoscience & nanotechnology, Microstructure, Copper, chemistry, Mechanics of Materials, [PHYS.COND.CM-MS]Physics [physics]/Condensed Matter [cond-mat]/Materials Science [cond-mat.mtrl-sci], lcsh:Materials of engineering and construction. Mechanics of materials, 0210 nano-technology |
| الوصف: | To improve the reliability of the power electronic modules for the high temperature applications, an innovative Thermal Bridge Composite (i-TBC) was designed. It has the architectured structure consisting of perforated FeNi36 sheet inserted between two Cu sheets. Due to simultaneous use of Cu and FeNi36, i-TBC possesses both a good thermal transverse conductivity and a limited longitudinal coefficient of thermal expansion. Different characterisations of i-TBC are required to understand the formation of its microstructure leading to the final properties. Therefore, the aim of this study was to analyse the integrity of Cu-Cu and Cu-FeNi36 interfaces as well as copper microstructure evolution throughout all elaboration steps: (i) first cold rolling, (ii) heat treatment and (iii) second cold rolling. First cold rolling did not lead to a bonding of Cu-Cu interfaces in the thermal bridge. Moreover, heterogeneity of Cu grain microstructure was observed with formation of ultra-fine grained structure close to junctions of Cu and FeNi36. The heat treatment led to a degradation of different interfaces adherence and to a complete copper recrystallization. Finally, the second cold rolling ensured an efficient solid welding of Cu-Cu interfaces and led to a heterogeneity of strain hardening of copper. Keywords: i-TBC, Cold rolling, Thermal bridge, Strain hardening, Cold welding, EBSD |
| تدمد: | 0264-1275 |
| DOI: | 10.1016/j.matdes.2017.10.009 |
| DOI: | 10.1016/j.matdes.2017.10.009⟩ |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_dedup___::151864363515758aad0a8a40be1b13ec https://doi.org/10.1016/j.matdes.2017.10.009 |
| Rights: | OPEN |
| رقم الانضمام: | edsair.doi.dedup.....151864363515758aad0a8a40be1b13ec |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 02641275 |
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| DOI: | 10.1016/j.matdes.2017.10.009 |