Interface reaction of Al/W and chemical properties of Al–W bimetallic bonding
العنوان: | Interface reaction of Al/W and chemical properties of Al–W bimetallic bonding |
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المؤلفون: | Mitsuo Tsukada, Shin‐ichi Ohfuji |
المصدر: | Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 13:2525-2531 |
بيانات النشر: | American Vacuum Society, 1995. |
سنة النشر: | 1995 |
مصطلحات موضوعية: | Materials science, Photoemission spectroscopy, Annealing (metallurgy), Oxide, Intermetallic, chemistry.chemical_element, Surfaces and Interfaces, Tungsten, Condensed Matter Physics, Surfaces, Coatings and Films, Metal, chemistry.chemical_compound, chemistry, Aluminium, visual_art, visual_art.visual_art_medium, Physical chemistry, Bimetallic strip |
الوصف: | Suppression mechanism by a thin interface W oxide layer is investigated for intermetallic reaction at Al/W interfaces. The interface reaction scheme of Al/W was analyzed by in situ x‐ray photoemission spectroscopy for the interface formation and subsequent annealing in ultrahigh vacuum. Without the W oxide layer at the interface, annealing at temperatures higher than 450 °C leads to an intermetallic reaction forming the bimetallic compound WAl12 through the entire metal layer, while no reaction between Al and W occurs at room temperature. The intermetallic reaction causes the lowering of W 4f core level by 0.7 eV. This is explained by the donation of a lone electron pair from an Al 3s orbital to a vacant W 6s orbital in bimetallic bonding. The interface thin W oxide layer, composed of WO3, is consumed in the oxidation–reduction reaction with metallic Al. The reaction product Al2O3 inhibits the intermetallic reaction. This results in an increase in annealing temperatures to as high as 600 °C and longer annealing time to form WAl12. |
تدمد: | 1520-8559 0734-2101 |
DOI: | 10.1116/1.579498 |
URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::fd550ce03618f966adae1ec89add963f https://doi.org/10.1116/1.579498 |
رقم الانضمام: | edsair.doi...........fd550ce03618f966adae1ec89add963f |
قاعدة البيانات: | OpenAIRE |
تدمد: | 15208559 07342101 |
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DOI: | 10.1116/1.579498 |