Thermal Conductivity of NI HTS Coil Fabricated by Diffusion Bonding Technique
| العنوان: | Thermal Conductivity of NI HTS Coil Fabricated by Diffusion Bonding Technique |
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| المؤلفون: | Junil Kim, Hongsoo Ha, Myung-Hwan Sohn, Sung-Kyu Kim, Gwantae Kim, Jaehwan Lee, Jeongmin Mun, Seokho Kim |
| المصدر: | IEEE Transactions on Applied Superconductivity. 32:1-5 |
| بيانات النشر: | Institute of Electrical and Electronics Engineers (IEEE), 2022. |
| سنة النشر: | 2022 |
| مصطلحات موضوعية: | Electrical and Electronic Engineering, Condensed Matter Physics, Electronic, Optical and Magnetic Materials |
| تدمد: | 2378-7074 1051-8223 |
| DOI: | 10.1109/tasc.2022.3172917 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::cfc57dc0b94d32693b052c8dbf17cfdc https://doi.org/10.1109/tasc.2022.3172917 |
| Rights: | CLOSED |
| رقم الانضمام: | edsair.doi...........cfc57dc0b94d32693b052c8dbf17cfdc |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 23787074 10518223 |
|---|---|
| DOI: | 10.1109/tasc.2022.3172917 |