Effect Of Ion-bombardment Intensity Due To The Charging On Sidewall Trench Formatiom

التفاصيل البيبلوغرافية
العنوان: Effect Of Ion-bombardment Intensity Due To The Charging On Sidewall Trench Formatiom
المؤلفون: H.C. Lee, S. Vanhaelemeersch, S. Beckx
المصدر: 2nd International Symposium on Plasma Process-Induced Damage.
بيانات النشر: IEEE, 1997.
سنة النشر: 1997
مصطلحات موضوعية: Fabrication, Materials science, Large Hadron Collider, Silicon, chemistry, Resist, Etching (microfabrication), Trench, chemistry.chemical_element, Electron, Atomic physics, Intensity (heat transfer)
DOI: 10.1109/ppid.1997.596753
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cee0808dc002e0cfb0d70d3b20d079e0
https://doi.org/10.1109/ppid.1997.596753
رقم الانضمام: edsair.doi...........cee0808dc002e0cfb0d70d3b20d079e0
قاعدة البيانات: OpenAIRE
الوصف
DOI:10.1109/ppid.1997.596753