Three dimensional stability analysis of high-temperature superconductors using the finite element method

التفاصيل البيبلوغرافية
العنوان: Three dimensional stability analysis of high-temperature superconductors using the finite element method
المؤلفون: E.E. Burkhardt, Justin Schwartz
المصدر: IEEE Transactions on Appiled Superconductivity. 9:240-243
بيانات النشر: Institute of Electrical and Electronics Engineers (IEEE), 1999.
سنة النشر: 1999
مصطلحات موضوعية: Superconductivity, Quenching, High-temperature superconductivity, Materials science, Condensed matter physics, Condensed Matter Physics, Thermal conduction, Finite element method, Electronic, Optical and Magnetic Materials, law.invention, Thermal conductivity, law, Condensed Matter::Superconductivity, Temperature jump, Electrical and Electronic Engineering, Anisotropy
الوصف: As the properties of high-temperature superconducting tapes improve, practical design considerations require more detailed analysis to prevent quenching. An important issue for high-temperature superconductors is stability; i.e. the ability to maintain or recover superconductivity in the event of a thermal disturbance or flux jump. As a result of the broad range of temperature during a transition and the strong temperature dependence and anisotropy of the material properties, the finite element method (FEM) is used to solve the three-dimensional heat conduction equation. The minimum quench energy for several sources is determined. The different cases considered include: convective boundary condition, source in BSCCO or Ag, increased anisotropy of thermal conductivity of BSCCO, increased critical current density and a constant source in Ag Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O-Ag.
تدمد: 1051-8223
DOI: 10.1109/77.783281
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bf677137750b88355352de74ae0c7b17
https://doi.org/10.1109/77.783281
Rights: CLOSED
رقم الانضمام: edsair.doi...........bf677137750b88355352de74ae0c7b17
قاعدة البيانات: OpenAIRE
الوصف
تدمد:10518223
DOI:10.1109/77.783281