Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters

التفاصيل البيبلوغرافية
العنوان: Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters
المؤلفون: S. Chakravarty, M. Harmes, S. List, Mauro J. Kobrinsky, M. Mazumder, Dan Jiao
المصدر: IEEE Transactions on Advanced Packaging. 28:57-62
بيانات النشر: Institute of Electrical and Electronics Engineers (IEEE), 2005.
سنة النشر: 2005
مصطلحات موضوعية: Optimal design, Engineering, business.industry, Computation, Capacitive sensing, Integrated circuit, law.invention, Microprocessor, law, Scattering parameters, Electronic engineering, System on a chip, Signal integrity, Electrical and Electronic Engineering, business
الوصف: Since the design of advanced microprocessors is based on simulation tools, accurate assessments of the amount of crosstalk noise are of paramount importance to avoid logic failures and less-than-optimal designs. With increasing clock frequencies, inductive effects become more important, and the validity of assumptions commonly used in simulation tools and approaches is unclear. We compared accurate experimental S-parameters with results derived from both magneto-quasi-static and full-wave simulation tools for simple crosstalk structures with various capacitive and inductive couplings, in the presence of parallel and orthogonal conductors. Our validation approach made possible the identification of the strengths and weaknesses of both tools as a function of frequency, which provides useful guidance to designers who have to balance the tradeoffs between accuracy and computation expenses for a large variety of cases
تدمد: 1521-3323
DOI: 10.1109/tadvp.2004.841672
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bef38b2961b1285f9603370deb32738b
https://doi.org/10.1109/tadvp.2004.841672
Rights: CLOSED
رقم الانضمام: edsair.doi...........bef38b2961b1285f9603370deb32738b
قاعدة البيانات: OpenAIRE
الوصف
تدمد:15213323
DOI:10.1109/tadvp.2004.841672