Effect of Process Parameters on Warpage of Printer Board with Metal-Insert

التفاصيل البيبلوغرافية
العنوان: Effect of Process Parameters on Warpage of Printer Board with Metal-Insert
المؤلفون: Cheng Juan Liu, Yan Ping Li, Hai Qin He, Qiu Ping Wu, Xian Kun Huang
المصدر: Advanced Materials Research. :1141-1146
بيانات النشر: Trans Tech Publications, Ltd., 2014.
سنة النشر: 2014
مصطلحات موضوعية: Engineering drawing, Materials science, Mold, General Engineering, medicine, Process (computing), Process variable, Molding (process), Composite material, medicine.disease_cause, Metal insert, Melt temperature
الوصف: In order to study the influence of process parameters on forming quality of printer board with metal-insert,shorten the development cycle,reduce the enterprise cost,the warp trend and reasons of injection process parameters,including packing time,hold pressure,mold temperature,melt temperature,on the warpage of the part were analyzed by means of software moldflow. The results show that warpage amounts decreases with packing time and hold pressure increasing,larger packing time and longer hold pressure is advantageous to the injection parts molding;And warpage amounts increases with mold temperature and melt temperature increasing,the lower mold temperature and melt temperature is advantageous to the injection parts molding;Among the four parameters,the melt temperature had the greatest influence,followed by the mold temperature and the hold pressure,packing time had the minimal influence on the warpage.
تدمد: 1662-8985
DOI: 10.4028/www.scientific.net/amr.1004-1005.1141
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::87e6233451f7a1ec6b94c739e3265d3d
https://doi.org/10.4028/www.scientific.net/amr.1004-1005.1141
Rights: CLOSED
رقم الانضمام: edsair.doi...........87e6233451f7a1ec6b94c739e3265d3d
قاعدة البيانات: OpenAIRE
الوصف
تدمد:16628985
DOI:10.4028/www.scientific.net/amr.1004-1005.1141