Simulation and Analysis for Capillarity Underfill Process in High Density FCBGA Packaging
| العنوان: | Simulation and Analysis for Capillarity Underfill Process in High Density FCBGA Packaging |
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| المؤلفون: | Yunting Liu, Cheng Xu, Rui Ma, Binjie Shi, Meiying Su, Qidong Wang, Liqiang Cao |
| المصدر: | 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). |
| بيانات النشر: | IEEE, 2022. |
| سنة النشر: | 2022 |
| DOI: | 10.1109/estc55720.2022.9939460 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::87b5ba12aa9b05533abb664c8b4d99ae https://doi.org/10.1109/estc55720.2022.9939460 |
| Rights: | CLOSED |
| رقم الانضمام: | edsair.doi...........87b5ba12aa9b05533abb664c8b4d99ae |
| قاعدة البيانات: | OpenAIRE |
| DOI: | 10.1109/estc55720.2022.9939460 |
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