Surface characterization of a semiconductor SiGe/Si heterostructure by contact angle measurements

التفاصيل البيبلوغرافية
العنوان: Surface characterization of a semiconductor SiGe/Si heterostructure by contact angle measurements
المؤلفون: P. Warren, M. Berenguer, E. Fadda, F. Chollet
المصدر: Journal of Adhesion Science and Technology. 10:1067-1074
بيانات النشر: Informa UK Limited, 1996.
سنة النشر: 1996
مصطلحات موضوعية: Materials science, Silicon, business.industry, chemistry.chemical_element, Heterojunction, Surfaces and Interfaces, General Chemistry, Surface finish, Surfaces, Coatings and Films, Characterization (materials science), Contact angle, Root mean square, Semiconductor, Optics, Planar, chemistry, Mechanics of Materials, Materials Chemistry, Optoelectronics, business
الوصف: For the integration of strained Si1-xGex epilayers in future silicon technologies it is necessary to obtain flat planar interfaces. Thus, a good understanding of the growth mechanism and a good knowledge of the properties of this strained material are required. Many articles have dealt with these problems in the literature. In a previous study, atomic force microscopy (AFM) was used to analyze the morphological modifications in SiGe epilayers grown on Si. The different stages of surface evolution have been determined, particularly the onset of undulations. In this study, we have investigated these surface modifications using the contact angle measurement technique. We observed a correlation between the root mean square (RMS) values of the roughness obtained with AFM and the water contact angle values. We demonstrate that the contact angle measurement technique, taking certain precautions, allows the critical thickness, i.e. the thickness beyond which the undulation pseudo-period increases, to be determine...
تدمد: 1568-5616
0169-4243
DOI: 10.1163/156856196x00102
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::802695e9675bd0dac34230a6239956e9
https://doi.org/10.1163/156856196x00102
رقم الانضمام: edsair.doi...........802695e9675bd0dac34230a6239956e9
قاعدة البيانات: OpenAIRE
الوصف
تدمد:15685616
01694243
DOI:10.1163/156856196x00102