We present a TCAD-based approach for characterizing hot-carrier degradation in p-channel MOSFETs that includes models for hot-electron injection, carrier transport, and electron trapping in the oxide. The energy-balance equations have been solved in the silicon substrate to accurately model the carrier-heating and injection processes. This approach clearly illustrates the physical mechanisms responsible for hot-carrier degradation in p-channel MOSFETs. The simulations have been compared with experimental data obtained from 0.8μm SOI pMOS devices and show an excellent match.