Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging
| العنوان: | Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging |
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| المؤلفون: | K K Zhang, H X Shi, C Y Li, Ran Feng Qiu, Y L Wang |
| المصدر: | Materials Science and Technology. 28:760-765 |
| بيانات النشر: | Informa UK Limited, 2012. |
| سنة النشر: | 2012 |
| مصطلحات موضوعية: | Materials science, Mechanics of Materials, Mechanical Engineering, Soldering, Metallurgy, Intermetallic, General Materials Science, Condensed Matter Physics, Joint (geology) |
| الوصف: | Aging treatment was implemented for the Sn2·5Ag0·7Cu0·1RExNi/Cu solder joint under various temperatures simulating the service environment. The growing behaviour of the intermetallic compound at the soldering interface during aging was investigated. In the case of adding 0·1%Ni aged solder joint, the maximum growth activation energies of (Cu,Ni)6Sn5 and Cu3Sn are 86·8 and 93·7 kJ mol−1 respectively. The results reveal that the growth of intermetallic compound in the soldering interface can be suppressed, and the solder joint can be strengthened by adding proper quantities of Ni in the solder. |
| تدمد: | 1743-2847 0267-0836 |
| DOI: | 10.1179/1743284711y.0000000131 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::6e04653608a891daa8e477df3c2c4d43 https://doi.org/10.1179/1743284711y.0000000131 |
| رقم الانضمام: | edsair.doi...........6e04653608a891daa8e477df3c2c4d43 |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 17432847 02670836 |
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| DOI: | 10.1179/1743284711y.0000000131 |