Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model
| العنوان: | Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model |
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| المؤلفون: | Marc Rensing, Peter O'Brien, Frank H. Peters, Wei Han |
| المصدر: | Journal of Electronic Packaging. 133 |
| بيانات النشر: | ASME International, 2011. |
| سنة النشر: | 2011 |
| مصطلحات موضوعية: | Materials science, business.industry, Structure (category theory), Resonance, Laser, Computer Science Applications, Electronic, Optical and Magnetic Materials, law.invention, Mechanics of Materials, law, Reflection (physics), Optoelectronics, Electromagnetic model, Electrical and Electronic Engineering, business, Microwave, Directly modulated laser |
| الوصف: | In this paper, the packaging aspects of directly modulated laser (DML) modules are investigated using detailed electromagnetic (EM) simulations. The packaging influences of the laser module are specified in two parts as RF connector and optoelectronic subsystem. By carefully optimizing the package structure, the simulation results show that the insertion loss of the proposed module is less than 1 dB up to 40 GHz. Then, a DML module is packaged and measured based on the optimized package scheme. A resonance free bandwidth of approximately 20 GHz is obtained with a 3 dB bandwidth of about 15 GHz. |
| تدمد: | 1528-9044 1043-7398 |
| DOI: | 10.1115/1.4005292 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::54f5e11c9222d0df83ba5df14107209e https://doi.org/10.1115/1.4005292 |
| رقم الانضمام: | edsair.doi...........54f5e11c9222d0df83ba5df14107209e |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 15289044 10437398 |
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| DOI: | 10.1115/1.4005292 |