Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
| العنوان: | Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs |
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| المؤلفون: | Robert R. Pearson, Sukwon Choi, Samuel Kim, Samuel Graham, Alexander S. Rattner, Bikramjit Chatterjee |
| المصدر: | Journal of Electronic Packaging. 142 |
| بيانات النشر: | ASME International, 2020. |
| سنة النشر: | 2020 |
| مصطلحات موضوعية: | 010302 applied physics, Materials science, business.industry, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Computer Science Applications, Electronic, Optical and Magnetic Materials, Reduced order, Heat flux, Mechanics of Materials, 0103 physical sciences, Thermal, Optoelectronics, Electrical and Electronic Engineering, 0210 nano-technology, business |
| الوصف: | The increasing demand for tightly integrated gallium nitride high electron mobility transistors (HEMT) into electronics systems requires accurate thermal evaluation. While these devices exhibit favorable electrical characteristics, the performance and reliability suffer from elevated operating temperatures. Localized device self-heating, with peak channel and die level heat fluxes of the order of 1 MW cm−2 and 1 kW cm−2, respectively, presents a need for thermal management that is reliant on accurate channel temperature predictions. In this publication, a high-fidelity multiphysics modeling approach employing one-way electrothermal coupling is validated against experimental results from Raman thermometry of a 60-finger gallium nitride (GaN) HEMT power amplifier under a set of direct current (DC)-bias conditions. A survey of commonly assumed reduced-order approximations, in the form of numerical and analytical models, are systematically evaluated with comparisons to the peak channel temperature rise of the coupled multiphysics model. Recommendations of modeling assumptions are made relating to heat generation, material properties, and composite layer discretization for numerical and analytical models. The importance of electrothermal coupling is emphasized given the structural and bias condition effect on the heat generation profile. Discretization of the composite layers, with temperature-dependent thermal properties that are physically representative, are also recommended. |
| تدمد: | 1528-9044 1043-7398 |
| DOI: | 10.1115/1.4046620 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::29012d2640061172c7864c22354b85d4 https://doi.org/10.1115/1.4046620 |
| Rights: | CLOSED |
| رقم الانضمام: | edsair.doi...........29012d2640061172c7864c22354b85d4 |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 15289044 10437398 |
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| DOI: | 10.1115/1.4046620 |