Periodical
Advancements in metrology for advanced semiconductor packaging
العنوان: | Advancements in metrology for advanced semiconductor packaging |
---|---|
المؤلفون: | de Groot, Peter J., Guzman, Felipe, Picart, Pascal, Chein, Wei-Hsin, Pandey, Gaurav, Das, Surajit, Chen, Liang-Chia |
المصدر: | Proceedings of SPIE; June 2024, Vol. 12997 Issue: 1 p129970R-129970R-16, 12867047p |
قاعدة البيانات: | Supplemental Index |
تدمد: | 0277786X |
---|---|
DOI: | 10.1117/12.3024745 |