Periodical
Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles
| العنوان: | Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles |
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| المؤلفون: | Kim, Sung Yoon, Kim, Myeong In, Lee, Jong-Hyun |
| المصدر: | Electronic Materials Letters; 20240101, Issue: Preprints p1-6, 6p |
| مستخلص: | Abstract: To achieve bondlines with improved heat resistance and thermal conductance during operation, pressure-assisted sinter-bonding was performed in air with bimodal Ag-coated Cu particles for die attachment of the next-generation power devices composed of SiC. The bonding temperature and pressure were 250 °C and 10 MPa, respectively, and the sizes of the bimodal particles were 2 µm and 350 nm. After a short bonding time of 10 min, a paste with a 6:4 mixing ratio showed an average shear strength of > 20 MPa. The dewetting of Ag shells on the particles and void filling by the 350 nm particles induced rapid sintering. Graphic Abstract: |
| قاعدة البيانات: | Supplemental Index |
| تدمد: | 17388090 20936788 |
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| DOI: | 10.1007/s13391-020-00208-1 |