Conference
A low temperature CVD Al plug and interconnect process for 0.25 /spl mu/m metallization technologies.
| العنوان: | A low temperature CVD Al plug and interconnect process for 0.25 /spl mu/m metallization technologies. |
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| المؤلفون: | Fiordalice, R., Blumenthal, R., Fernandes, M., Garcia, S., Gelatos, J., Kawasaki, H., Klein, J., Marsh, R., Ong, T., Venkatraman, R., Weitzman, E., Pintchovski, F. |
| المصدر: | 1996 Symposium on VLSI Technology Digest of Technical Papers; 1996, p42-43, 2p |
| قاعدة البيانات: | Complementary Index |
| ردمك: | 9780780333420 |
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| DOI: | 10.1109/VLSIT.1996.507786 |