التفاصيل البيبلوغرافية
| العنوان: |
Galvanic replacement deposited copper layer as an efficient activator to realize electroless Ni-P plating on aluminum. |
| المؤلفون: |
Zhao, Qiuping, Liao, Wanda, Li, Rupeng, Hu, Guanqun, Bai, Changning, Zhang, Xingkai |
| المصدر: |
Journal of Solid State Electrochemistry; Sep2024, Vol. 28 Issue 9, p3175-3186, 12p |
| مصطلحات موضوعية: |
ELECTROLESS plating, COPPER, SUBSTRATES (Materials science), ALUMINUM plates, ALUMINUM ores |
| مستخلص: |
Electroless Ni-P plating is an important process to enhance the corrosion and wear resistance of aluminum. However, due to the presence of an oxide layer on aluminum substrate, achieving a reliable Ni-P coating necessitates complex processes such as double zincate treatment or palladium immersion pretreatment. This study demonstrates that the copper immersion layer on an aluminum substrate can initiate the electroless Ni-P plating process. The copper immersion layer is deposited on the aluminum substrate through a convenient galvanic replacement reaction using an alkaline aqueous solution of copper sulfate and ammonia. This copper immersion layer can form a galvanic cell with the aluminum substrate, thereby initiating electroless Ni-P plating, similar to initiate electroless Ni-P plating by contact activation. It is confirmed that activation ability of the copper immersion layer is comparable to that of a palladium immersion layer by comparing the morphology, structure, deposition kinetics, and performance of Ni-P coatings obtained on copper and palladium immersion layers. [ABSTRACT FROM AUTHOR] |
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| قاعدة البيانات: |
Complementary Index |