التفاصيل البيبلوغرافية
| العنوان: |
小型化电子产品热应变作用下接触传热仿真分析. (Chinese) |
| Alternate Title: |
Simulation analysis of contact heat transfer under thermal strain for miniaturized electronics. (English) |
| المؤلفون: |
肖卫强, 李特, 蒋健, 徐建, 周国俊, 汪华文, 韩玉峰, 詹望成 |
| المصدر: |
Journal of Fuzhou University; Feb2023, Vol. 51 Issue 1, p97-103, 7p |
| Abstract (English): |
In the process of designing electronic products with miniaturized structural features, it is difficult to estimate the influence of thermal strain on contact heat transfer of components during operation. Herein, contact heat transfer between polypropylene (PP) and 316 stainless steel (SS316) was studied. The equivalent geometry model of rough contact surface was established based on roughness microscopic theory. The thermal strain of PP/SS316 and SS316/SS316 models was simulated by finite element method. The heat transfer process in the thermal strain model was studied by calculating fluid mechanics. The results showed that gas convection and radiation in micron and submillimeter scale gaps have negligible effects on total heat transfer gravity and radiation had no effect on contact heat transfer. The rounding model is better for describing rough peaks of materials with high elastic modulus. Thermal strain mainly occurs in the gap flat location, and thermal deformation of PP/SS316 model is up to 2.6μm. The proportion of air heat transfer in the contact gap decreases with the increase of gap and thermal conductivity of material, regardless of operation temperature of the material. [ABSTRACT FROM AUTHOR] |
| Abstract (Chinese): |
在设计小型化结构特征电子产品的过程中，组件在工作时的热应变对接触传热影响难以估算. 针对此问题，以聚丙烯(PP)和316不锈钢(SS316)材料作为研究对象，采用粗糙度微观理论建立粗糙接触面等效接触几何模型，研究其接触传热. 采用有限元方法模拟PP/SS316、SS316/SS316组合模型的热应变，采用计算流体力学方法研究热应变模型的传热过程. 结果表明： 在普通工业和消费电子领域的传热仿真中，微米和亚毫米级间隙中的气体对流和辐射对总传热影响可以忽略；圆台模型更适合于描述高弹性模量材料的粗糙峰；PP/SS316组合热应变主要发生在接触面平坦位置，热变形量大为2.6μm；接触间隙空气传热通量占比随间隙和材料热导率的增加而减少，而与材料使用温度无关. [ABSTRACT FROM AUTHOR] |
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| قاعدة البيانات: |
Complementary Index |