Academic Journal

Evaluation of dopamine and dopamine derivatives as additives in epoxy resin for structural adhesive applications.

التفاصيل البيبلوغرافية
العنوان: Evaluation of dopamine and dopamine derivatives as additives in epoxy resin for structural adhesive applications.
المؤلفون: Tran, Ngon T., Boyer, Avery J., Busch, Casey E., Bartucci, Matthew A., Orlicki, Joshua A., Lenhart, Joseph L., Knorr, Daniel B.
المصدر: Journal of Adhesion; 2023, Vol. 99 Issue 5, p853-868, 16p
مصطلحات موضوعية: RESIN adhesives, EPOXY resins, DOPAMINE, DYNAMIC mechanical analysis, CATECHOL, SHEAR strength, MONOMERS
مستخلص: Dry and hot/wet lap shear specimens were prepared and tested to evaluate catechol-containing additives in a model epoxy adhesive. We specifically compared adding neutral dopamine, which is capable of being covalently incorporated into the epoxy network, with molecular analogues that contain methyl, methoxy and fluorine rather than hydroxyl groups. We found that catechol was unique among these additives in improving both dry and hot/wet lap shear strength. While neutral dopamine can only be added to relatively low concentrations due to solubility limitations, other catechol-containing polymers and monomers based on maleimide also showed increases in dry and hot/wet lap shear strength upon incorporation. Dynamic mechanical analysis measurements suggested that the differences observed were not likely due to differences in either polymer mechanical properties or polymer topology. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Adhesion is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
قاعدة البيانات: Complementary Index
الوصف
تدمد:00218464
DOI:10.1080/00218464.2022.2059354