التفاصيل البيبلوغرافية
| العنوان: |
Electrical Performance of the Recessed Probe Launch Technique for Measurement of Embedded Multilayer Structures. |
| المؤلفون: |
Kotzev, Miroslav1, Rimolo-Donadio, Renato2, Kwark, Young H.3, Baks, Christian W.3, Gu, Xiaoxiong3, Schuster, Christian1 |
| المصدر: |
IEEE Transactions on Instrumentation & Measurement. Dec2012, Vol. 61 Issue 12, p3198-3206. 9p. |
| مصطلحات موضوعية: |
*BANDWIDTHS, PRINTED circuits, MICROPROBE analysis, CALIBRATION, ELECTRIC circuits |
| مستخلص: |
This paper explores the electrical performance of a recessed probe launch (RPL) technique for measurement of embedded (internal) printed circuit board (PCB) structures such as striplines and vias (plated through holes). The RPL uses high-frequency microprobes in combination with a milling technique that removes upper board layers and exposes internal probing points. A two-tier calibration technique is applied for the extraction of the S-parameters of the RPLs with the help of thru-reflect-line calibration standards designed on PCB. Full-wave models are used to corroborate and validate the obtained S-parameters. Good model-to-hardware correlation is obtained up to 40 GHz. Furthermore, the launch performance with respect to microprobe positioning and variations of the cavity size is investigated using the full-wave models. These simulations suggest techniques for launch optimization and probe modifications that improve the launch measurement bandwidth. [ABSTRACT FROM PUBLISHER] |
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| قاعدة البيانات: |
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