Periodical
Ultra-thin die ease thermal management.
| العنوان: | Ultra-thin die ease thermal management. |
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| المؤلفون: | Fabel, Michael1 |
| المصدر: | Portable Design. Dec2003, Vol. 9 Issue 12, p18-20. 2p. |
| مصطلحات موضوعية: | *MOBILE communication systems, TEMPERATURE control |
| مستخلص: | Discusses the use of thin die to ease thermal management in mobile communication systems. Pros and cons of using thin die; Compound semiconductors; Process considerations. |
| قاعدة البيانات: | Business Source Index |
| تدمد: | 10861300 |
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