التفاصيل البيبلوغرافية
| العنوان: |
A low-power transmitter driver for die to die. |
| المؤلفون: |
REN Bo-lin1, XIAO Li-quan1, QI Xing-yun1, ZHANG Geng1, WANG Qiang1, LUO Zhang1, PANG Zheng-bin1, XU Jia-qin1 |
| المصدر: |
Computer Engineering & Science / Jisuanji Gongcheng yu Kexue. Apr2024, Vol. 46 Issue 4, p599-605. 7p. |
| مستخلص: |
A low-power transmitter driver for chiplet interconnection was designed and experimentally implemented based on the interchip interconnection standard proposed by the UCIe protocol. The driver circuit adopts a source series terminated (SST) diver, whose power consumption is only 1/4 that of the current mode logic (CML) structure. In add-on, based on adjustable feedforward equalization technology, the driver circuit adjusts the equalization strength for different channel attenuations. By de-emphasizing equalization, it enhances the quality of the transmitted signal, ultimately reducing inter-symbol interference. This circuit was designed under CMOS 28 nm process. The front-end simulation results show that the maximum equalization intensity is --3. 7 dB when the 0. 9 V voltage is supplied. When the 32 Gbps NRZ signal passes through the 21 mm channel (the attenuation at the 16 GHz Nyquist frequency is --2. 37 dB), after adjusting the appropriate equalization intensity, the eye height of the output waveform eye diagram is 253 mV (71.8%), the eye width is 27 ps (87%), and the simulation power consumption is only 4. 0 mW. [ABSTRACT FROM AUTHOR] |
| قاعدة البيانات: |
Academic Search Index |