Patent
Apparatus and method for modifying an object
العنوان: | Apparatus and method for modifying an object |
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Patent Number: | 7,323,699 |
تاريخ النشر: | January 29, 2008 |
Appl. No: | 11/047877 |
Application Filed: | February 02, 2005 |
مستخلص: | A method and apparatus includes positioning a reactant on a surface in specific location and then directing an energy source from a device at the reactant such that it modifies the surface to either remove material or add material. |
Inventors: | Hopkins, Barry F. (Hobe Sound, FL, US); Ray, David J. (Agoura Hills, CA, US); LeClaire, Jeffrey E. (Boca Raton, FL, US); White, Roy (Wellington, FL, US) |
Assignees: | Rave, LLC (Delray Beach, FL, US) |
Claim: | 1. An apparatus for modifying an object, comprising: a moveable probe with a probe tip positioned adjacent to the object; a reactant that is positioned on the object; and an energy device configured to direct its output directly at the reactant in order to modify the object wherein the reactant is placed on the probe tip through an electrostatic process. |
Claim: | 2. The apparatus as in claim 1 , wherein the probe is included in an assembly that is configured to position the reactant on the object. |
Claim: | 3. The apparatus as in claim 2 , wherein the assembly is a scanning probe microscope. |
Claim: | 4. The apparatus as in claim 3 , wherein the reactant is positioned with a probe tip of the scanning probe microscope. |
Claim: | 5. The apparatus as in claim 4 , wherein the reactant is placed on the probe tip through a hydrophilic process. |
Claim: | 6. The apparatus as in claim 1 , wherein the energy device is an electromagnetic device. |
Claim: | 7. The apparatus as in claim 1 , wherein the energy device is a laser. |
Claim: | 8. The apparatus as in claim 7 , wherein the added material is linked to another portion of the object. |
Claim: | 9. The apparatus as in claim 1 , wherein the energy device is configured to directed radio waves at the sample. |
Claim: | 10. The apparatus as in claim 1 , wherein in the object is a single layered device. |
Claim: | 11. The apparatus as in claim 1 , wherein the object is comprised of at least two layers. |
Claim: | 12. The apparatus as in claim 11 , wherein one of the at least two layers is configured to act as a stop layer. |
Claim: | 13. The apparatus as in claim 11 , wherein the reactant is configured to removed material from one of the at least two layers and not react with the second of the at least two layers. |
Claim: | 14. The apparatus as in claim 1 , wherein the object is a semiconductor device. |
Claim: | 15. The apparatus as in claim 1 , wherein the reactant is configured to remove material from the object. |
Claim: | 16. The apparatus as in claim 1 , wherein the reactant is configured to add material to the object. |
Claim: | 17. The apparatus as in claim 16 , wherein the added material is a conductor. |
Claim: | 18. The apparatus as in claim 16 , wherein the added material is an insulator. |
Claim: | 19. The apparatus as in claim 1 , wherein the reactant is selected based upon the object. |
Claim: | 20. The apparatus as in claim 1 , wherein the energy device is configured to increase a reaction time of the reactant on the object. |
Claim: | 21. The apparatus as in claim 1 , further comprising a probe assembly and fluid delivery channel. |
Claim: | 22. The apparatus as in claim 1 , further comprising a debris removal means. |
Claim: | 23. The apparatus of claim 1 , further comprising the steps of placing reactant in multiple locations to create specific shaped features. |
Current U.S. Class: | 2504/922 |
Patent References Cited: | 3991296 November 1976 Kojima et al. 4037075 July 1977 Pugsley et al. 4379022 April 1983 Melcher et al. 4413020 November 1983 McKee et al. 4414059 November 1983 Blum et al. 4568409 February 1986 Caplan 4697041 September 1987 Okaniwa et al. 4877481 October 1989 Fukuda et al. 4987855 January 1991 Ahlgren 5183534 February 1993 FjAre et al. 5298760 March 1994 Fuchs et al. 5432015 July 1995 Wu et al. 5460687 October 1995 Douglas 5569398 October 1996 Sun et al. 5569399 October 1996 Penney et al. 5641391 June 1997 Hunter et al. 5679472 October 1997 Wu et al. 5683547 November 1997 Azuma et al. 5702565 December 1997 Wu et al. 5824374 October 1998 Bradley, Jr. et al. 5830376 November 1998 Bohlke et al. 5932118 August 1999 Yamamoto et al. 6007969 December 1999 Hatakeyama et al. 6063695 May 2000 Lin et al. 6337479 January 2002 Kley 6353219 March 2002 Kley 6395650 May 2002 Callegari et al. 6403388 June 2002 Birdsley et al. 6555016 April 2003 Lai 6635311 October 2003 Mirkin et al. 6674074 January 2004 Schwartz 6679996 January 2004 Yao 6709720 March 2004 Hayakawa et al. 6737646 May 2004 Schwartz 6827979 December 2004 Mirkin et al. 6998689 February 2006 Kley 7005389 February 2006 Ko et al. 2003/0068446 April 2003 Mirkin et al. 2003/0157254 August 2003 Mirkin et al. 2004/0008330 January 2004 Mirkin et al. 2004/0028814 February 2004 Mirkin et al. 2004/0037959 February 2004 Mirkin et al. 2005/0016954 January 2005 Hamann et al. 2005/0247874 November 2005 Ando et al. 359067634 April 1984 401295424 November 1989 2001319923 November 2001 WO2004/023490 March 2004 |
Other References: | M. Datta, et al., “Laser Etching Of Metals In Neutral Salt Solutions”, Appl. Phys. Lett. 51(24), Dec. 14, 1987, pp. 2040-2042. cited by other R.J. VonGutfeld, et al., “Laser Enhanced Etching in KOH”, Appl. Phys. Lett. 40(4), Feb. 15, 1982, pp. 352-354. cited by other Y.S. Shin, et al., “Laser-Assisted Etching of Titanium Foil in Phosphoric Acid for Direct Fabrication of Microstructures”, Journal of Laser Applications, 15(4), Nov. 2003, pp. 240-246. cited by other P.A. Moskowitz, et al., “Laser Micromachining of Polyimide Materials”, Polyimides, vol. 1, 1984, pp. 365-376. cited by other R.J. vonGutfeld et al., “Electrochemical Microfabrication by Laser-Enhanced Photothermal Processes”, 42(5), 1998, pp. 1-12. cited by other B.W. Hussey, et al., “Role of Bubbles in Laser-Assisted Wet Etching”, Appl. Phys. Lett. 58(24), Jun. 17, 1991, pp. 2851-2853. cited by other Edward K. Yung, et al., “Laser-Assisted Etching of Manganese-Zinc-Ferrite”, J. Electrochem. Soc., vol. 136, No. 3, Mar. 1989, p. 665. cited by other A. Aliouchouche, et al., “Laser Chemical Etching of Copper Films”, SPIE, vol. 2403, pp. 425-2403. cited by other R.J. vonGutfeld, et al., “Laser Chemical Etching of Metals in Sodium Nitrate Solutions”, J. Appl. Phys. 64(10), Nov. 15, 1988, pp. 5197-5200. cited by other R. Nowak, et al., “Laser Chemical Etching of Metals in Liquids”, Materials and Manufacturing Processes, vol. 9, No. 3, pp. 429-446, 1994. cited by other |
Primary Examiner: | Wells, Nikita |
Attorney, Agent or Firm: | Baker & Hostetler LLP |
رقم الانضمام: | edspgr.07323699 |
قاعدة البيانات: | USPTO Patent Grants |
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edspgr USPTO Patent Grants edspgr.07323699 718 3 Patent patent 717.858520507813 |
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Array ( [Name] => DocumentID [Label] => Patent Number [Group] => Patent [Data] => 7,323,699 ) Array ( [Name] => DateEntry [Label] => Publication Date [Group] => Patent [Data] => January 29, 2008 ) Array ( [Name] => DocumentID [Label] => Appl. No [Group] => Patent [Data] => 11/047877 ) Array ( [Name] => DateFiled [Label] => Application Filed [Group] => Patent [Data] => February 02, 2005 ) Array ( [Name] => Abstract [Label] => Abstract [Group] => Ab [Data] => A method and apparatus includes positioning a reactant on a surface in specific location and then directing an energy source from a device at the reactant such that it modifies the surface to either remove material or add material. ) Array ( [Name] => Author [Label] => Inventors [Group] => Patent [Data] => <searchLink fieldCode="ZA" term="%22Hopkins%2C+Barry+F%2E%22">Hopkins, Barry F.</searchLink> (Hobe Sound, FL, US); <searchLink fieldCode="ZA" term="%22Ray%2C+David+J%2E%22">Ray, David J.</searchLink> (Agoura Hills, CA, US); <searchLink fieldCode="ZA" term="%22LeClaire%2C+Jeffrey+E%2E%22">LeClaire, Jeffrey E.</searchLink> (Boca Raton, FL, US); <searchLink fieldCode="ZA" term="%22White%2C+Roy%22">White, Roy</searchLink> (Wellington, FL, US) ) Array ( [Name] => OtherAuthors [Label] => Assignees [Group] => Patent [Data] => <searchLink fieldCode="ZS" term="%22Rave%2C+LLC%22">Rave, LLC</searchLink> (Delray Beach, FL, US) ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 1. An apparatus for modifying an object, comprising: a moveable probe with a probe tip positioned adjacent to the object; a reactant that is positioned on the object; and an energy device configured to direct its output directly at the reactant in order to modify the object wherein the reactant is placed on the probe tip through an electrostatic process. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 2. The apparatus as in claim 1 , wherein the probe is included in an assembly that is configured to position the reactant on the object. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 3. The apparatus as in claim 2 , wherein the assembly is a scanning probe microscope. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 4. The apparatus as in claim 3 , wherein the reactant is positioned with a probe tip of the scanning probe microscope. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 5. The apparatus as in claim 4 , wherein the reactant is placed on the probe tip through a hydrophilic process. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 6. The apparatus as in claim 1 , wherein the energy device is an electromagnetic device. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 7. The apparatus as in claim 1 , wherein the energy device is a laser. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 8. The apparatus as in claim 7 , wherein the added material is linked to another portion of the object. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 9. The apparatus as in claim 1 , wherein the energy device is configured to directed radio waves at the sample. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 10. The apparatus as in claim 1 , wherein in the object is a single layered device. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 11. The apparatus as in claim 1 , wherein the object is comprised of at least two layers. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 12. The apparatus as in claim 11 , wherein one of the at least two layers is configured to act as a stop layer. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 13. The apparatus as in claim 11 , wherein the reactant is configured to removed material from one of the at least two layers and not react with the second of the at least two layers. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 14. The apparatus as in claim 1 , wherein the object is a semiconductor device. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 15. The apparatus as in claim 1 , wherein the reactant is configured to remove material from the object. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 16. The apparatus as in claim 1 , wherein the reactant is configured to add material to the object. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 17. The apparatus as in claim 16 , wherein the added material is a conductor. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 18. The apparatus as in claim 16 , wherein the added material is an insulator. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 19. The apparatus as in claim 1 , wherein the reactant is selected based upon the object. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 20. The apparatus as in claim 1 , wherein the energy device is configured to increase a reaction time of the reactant on the object. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 21. The apparatus as in claim 1 , further comprising a probe assembly and fluid delivery channel. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 22. The apparatus as in claim 1 , further comprising a debris removal means. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 23. The apparatus of claim 1 , further comprising the steps of placing reactant in multiple locations to create specific shaped features. ) Array ( [Name] => CodeClass [Label] => Current U.S. Class [Group] => Patent [Data] => 2504/922 ) Array ( [Name] => Ref [Label] => Patent References Cited [Group] => Patent [Data] => <searchLink fieldCode="RF" term="%223991296%22">3991296</searchLink> November 1976 Kojima et al.<br /><searchLink fieldCode="RF" term="%224037075%22">4037075</searchLink> July 1977 Pugsley et al.<br /><searchLink fieldCode="RF" term="%224379022%22">4379022</searchLink> April 1983 Melcher et al.<br /><searchLink fieldCode="RF" term="%224413020%22">4413020</searchLink> November 1983 McKee et al.<br /><searchLink fieldCode="RF" term="%224414059%22">4414059</searchLink> November 1983 Blum et al.<br /><searchLink fieldCode="RF" term="%224568409%22">4568409</searchLink> February 1986 Caplan<br /><searchLink fieldCode="RF" term="%224697041%22">4697041</searchLink> September 1987 Okaniwa et al.<br /><searchLink fieldCode="RF" term="%224877481%22">4877481</searchLink> October 1989 Fukuda et al.<br /><searchLink fieldCode="RF" term="%224987855%22">4987855</searchLink> January 1991 Ahlgren<br /><searchLink fieldCode="RF" term="%225183534%22">5183534</searchLink> February 1993 FjAre et al.<br /><searchLink fieldCode="RF" term="%225298760%22">5298760</searchLink> March 1994 Fuchs et al.<br /><searchLink fieldCode="RF" term="%225432015%22">5432015</searchLink> July 1995 Wu et al.<br /><searchLink fieldCode="RF" term="%225460687%22">5460687</searchLink> October 1995 Douglas<br /><searchLink fieldCode="RF" term="%225569398%22">5569398</searchLink> October 1996 Sun et al.<br /><searchLink fieldCode="RF" term="%225569399%22">5569399</searchLink> October 1996 Penney et al.<br /><searchLink fieldCode="RF" term="%225641391%22">5641391</searchLink> June 1997 Hunter et al.<br /><searchLink fieldCode="RF" term="%225679472%22">5679472</searchLink> October 1997 Wu et al.<br /><searchLink fieldCode="RF" term="%225683547%22">5683547</searchLink> November 1997 Azuma et al.<br /><searchLink fieldCode="RF" term="%225702565%22">5702565</searchLink> December 1997 Wu et al.<br /><searchLink fieldCode="RF" term="%225824374%22">5824374</searchLink> October 1998 Bradley, Jr. et al.<br /><searchLink fieldCode="RF" term="%225830376%22">5830376</searchLink> November 1998 Bohlke et al.<br /><searchLink fieldCode="RF" term="%225932118%22">5932118</searchLink> August 1999 Yamamoto et al.<br /><searchLink fieldCode="RF" term="%226007969%22">6007969</searchLink> December 1999 Hatakeyama et al.<br /><searchLink fieldCode="RF" term="%226063695%22">6063695</searchLink> May 2000 Lin et al.<br /><searchLink fieldCode="RF" term="%226337479%22">6337479</searchLink> January 2002 Kley<br /><searchLink fieldCode="RF" term="%226353219%22">6353219</searchLink> March 2002 Kley<br /><searchLink fieldCode="RF" term="%226395650%22">6395650</searchLink> May 2002 Callegari et al.<br /><searchLink fieldCode="RF" term="%226403388%22">6403388</searchLink> June 2002 Birdsley et al.<br /><searchLink fieldCode="RF" term="%226555016%22">6555016</searchLink> April 2003 Lai<br /><searchLink fieldCode="RF" term="%226635311%22">6635311</searchLink> October 2003 Mirkin et al.<br /><searchLink fieldCode="RF" term="%226674074%22">6674074</searchLink> January 2004 Schwartz<br /><searchLink fieldCode="RF" term="%226679996%22">6679996</searchLink> January 2004 Yao<br /><searchLink fieldCode="RF" term="%226709720%22">6709720</searchLink> March 2004 Hayakawa et al.<br /><searchLink fieldCode="RF" term="%226737646%22">6737646</searchLink> May 2004 Schwartz<br /><searchLink fieldCode="RF" term="%226827979%22">6827979</searchLink> December 2004 Mirkin et al.<br /><searchLink fieldCode="RF" term="%226998689%22">6998689</searchLink> February 2006 Kley<br /><searchLink fieldCode="RF" term="%227005389%22">7005389</searchLink> February 2006 Ko et al.<br /><searchLink fieldCode="RF" term="%222003%2E0068446%22">2003/0068446</searchLink> April 2003 Mirkin et al.<br /><searchLink fieldCode="RF" term="%222003%2E0157254%22">2003/0157254</searchLink> August 2003 Mirkin et al.<br /><searchLink fieldCode="RF" term="%222004%2E0008330%22">2004/0008330</searchLink> January 2004 Mirkin et al.<br /><searchLink fieldCode="RF" term="%222004%2E0028814%22">2004/0028814</searchLink> February 2004 Mirkin et al.<br /><searchLink fieldCode="RF" term="%222004%2E0037959%22">2004/0037959</searchLink> February 2004 Mirkin et al.<br /><searchLink fieldCode="RF" term="%222005%2E0016954%22">2005/0016954</searchLink> January 2005 Hamann et al.<br /><searchLink fieldCode="RF" term="%222005%2E0247874%22">2005/0247874</searchLink> November 2005 Ando et al.<br /><searchLink fieldCode="RF" term="%22359067634%22">359067634</searchLink> April 1984<br /><searchLink fieldCode="RF" term="%22401295424%22">401295424</searchLink> November 1989<br /><searchLink fieldCode="RF" term="%222001319923%22">2001319923</searchLink> November 2001<br />WO2004/023490 March 2004<br /><br /><br /><br /><br /><br /><br /><br /><br /><br /> ) Array ( [Name] => Ref [Label] => Other References [Group] => Patent [Data] => M. Datta, et al., “Laser Etching Of Metals In Neutral Salt Solutions”, Appl. Phys. Lett. 51(24), Dec. 14, 1987, pp. 2040-2042. cited by other<br />R.J. VonGutfeld, et al., “Laser Enhanced Etching in KOH”, Appl. Phys. Lett. 40(4), Feb. 15, 1982, pp. 352-354. cited by other<br />Y.S. Shin, et al., “Laser-Assisted Etching of Titanium Foil in Phosphoric Acid for Direct Fabrication of Microstructures”, Journal of Laser Applications, 15(4), Nov. 2003, pp. 240-246. cited by other<br />P.A. Moskowitz, et al., “Laser Micromachining of Polyimide Materials”, Polyimides, vol. 1, 1984, pp. 365-376. cited by other<br />R.J. vonGutfeld et al., “Electrochemical Microfabrication by Laser-Enhanced Photothermal Processes”, 42(5), 1998, pp. 1-12. cited by other<br />B.W. Hussey, et al., “Role of Bubbles in Laser-Assisted Wet Etching”, Appl. Phys. Lett. 58(24), Jun. 17, 1991, pp. 2851-2853. cited by other<br />Edward K. Yung, et al., “Laser-Assisted Etching of Manganese-Zinc-Ferrite”, J. Electrochem. Soc., vol. 136, No. 3, Mar. 1989, p. 665. cited by other<br />A. Aliouchouche, et al., “Laser Chemical Etching of Copper Films”, SPIE, vol. 2403, pp. 425-2403. cited by other<br />R.J. vonGutfeld, et al., “Laser Chemical Etching of Metals in Sodium Nitrate Solutions”, J. Appl. Phys. 64(10), Nov. 15, 1988, pp. 5197-5200. cited by other<br />R. Nowak, et al., “Laser Chemical Etching of Metals in Liquids”, Materials and Manufacturing Processes, vol. 9, No. 3, pp. 429-446, 1994. cited by other ) Array ( [Name] => AuthorEditor [Label] => Primary Examiner [Group] => Patent [Data] => <searchLink fieldCode="ZE" term="%22Wells%2C+Nikita%22">Wells, Nikita</searchLink> ) Array ( [Name] => AuthorCorporate [Label] => Attorney, Agent or Firm [Group] => Patent [Data] => <searchLink fieldCode="ZG" term="%22Baker+%26+Hostetler+LLP%22">Baker & Hostetler LLP</searchLink> ) Array ( [Name] => AN [Label] => Accession Number [Group] => ID [Data] => edspgr.07323699 ) |
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