Patent
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
| العنوان: | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD |
|---|---|
| Document Number: | 20120304458 |
| تاريخ النشر: | December 6, 2012 |
| Appl. No: | 13/408597 |
| Application Filed: | February 29, 2012 |
| مستخلص: | A method for manufacturing a printed wiring board includes preparing a core substrate having first and second surfaces, forming a penetrating hole from the first surface toward the second surface of the substrate, forming first conductor on the first surface of the substrate, forming second conductor on the second surface of the substrate, and filling conductive material in the hole such that through-hole conductor connecting the first and second conductors is formed. The forming of the hole includes forming a first opening portion on the first-surface side of the substrate, a second opening portion from the bottom of the first portion toward the second surface, and a third opening portion from the bottom of the second portion toward the second surface, and the forming of the hole satisfies X2 |
| Inventors: | Yamauchi, Tsutomu (Ogaki-shi, JP); Kawai, Satoru (Ogaki-shi, JP) |
| Assignees: | IBIDEN CO., LTD. (Ogaki-shi, JP) |
| Claim: | 1. A method for manufacturing a printed wiring board, comprising: preparing a core substrate having a first surface and a second surface on an opposite side of the first surface; forming a penetrating hole from the first surface of the core substrate toward the second surface; forming a first conductor on the first surface of the core substrate; forming a second conductor on the second surface of the core substrate; and filling a conductive material in the penetrating hole such that a through-hole conductor connecting the first conductor and the second conductor is formed, wherein the forming of the penetrating hole includes forming a first opening portion on a first-surface side of the core substrate, forming a second opening portion from a bottom portion of the first opening portion toward the second surface, and forming a third opening portion from a bottom portion of the second opening portion toward the second surface, and the forming of the penetrating hole satisfies X2 |
| Claim: | 2. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the first opening portion comprises decreasing the diameter of the first opening portion from the first surface of the core substrate toward the second surface, and the forming of the second opening portion comprises decreasing the diameter of the second opening portion toward the second surface. |
| Claim: | 3. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the penetrating hole comprises forming a bent portion at a connected area of the first opening portion and the second opening portion. |
| Claim: | 4. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the penetrating hole comprises forming a bent portion at a connected area of the second opening portion and the third opening portion. |
| Claim: | 5. The method for manufacturing a printed wiring board according to claim 2, wherein the forming of the penetrating hole satisfies ΔW1>ΔW2 where ΔW1 represents a ratio at which the diameter of the first opening portion decreases in a direction from the first surface of the core substrate to the second surface, and ΔW2 represents a ratio at which the diameter of the second opening portion decreases in a direction from the first surface of the core substrate to the second surface. |
| Claim: | 6. The method for manufacturing a printed wiring board according to claim 1, further comprising: forming a first metal film on the first surface of the core substrate; and forming a second metal film on the second surface of the core substrate. |
| Claim: | 7. The method for manufacturing a printed wiring board according to claim 6, wherein the second metal film has a fourth opening portion which is contiguous to the third opening portion, and the fourth opening portion has a diameter which is set smaller than the diameter of the second opening portion. |
| Claim: | 8. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the first opening portion comprises forming an aperture, and the forming of the second opening portion comprises forming an aperture having an opening diameter which is set smaller than an opening diameter of the aperture for forming the first opening portion. |
| Claim: | 9. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the second opening portion comprises forming an aperture, and the forming of the third opening portion comprises forming an aperture having an opening diameter which is set same as an opening diameter of the aperture for forming the second opening portion. |
| Claim: | 10. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the first opening portion comprises irradiating laser, and the forming of the second opening portion comprises irradiating laser having a laser pulse width which is set longer than a laser pulse width of the laser for forming the first opening portion. |
| Claim: | 11. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the second opening portion comprises irradiating laser, and the forming of the third opening portion comprises irradiating laser having a laser pulse width which is set same as a laser pulse width of the laser for forming the second opening portion. |
| Claim: | 12. The method for manufacturing a printed wiring board according to claim 1, wherein the core substrate has a thickness which is set at 0.4 mm or less. |
| Claim: | 13. The method for manufacturing a printed wiring board according to claim 1, wherein the filling of the conductive material comprises plating the penetrating hole such that the penetrating hole is filled by a plating material. |
| Claim: | 14. The method for manufacturing a printed wiring board according to claim 1, wherein the filling of the conductive material comprises electrolytically plating the penetrating hole such that the penetrating hole is filled by an electrolytic plating material. |
| Claim: | 15. The method for manufacturing a printed wiring board according to claim 1, further comprising immersing the core substrate in an electroless plating solution such that an electroless plating film is formed on the first and second surfaces of the core substrate and on an inner wall of the penetrating hole. |
| Current U.S. Class: | 29/829 |
| Current International Class: | 05 |
| رقم الانضمام: | edspap.20120304458 |
| قاعدة البيانات: | USPTO Patent Applications |
| ResultId |
1 |
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| Header |
edspap USPTO Patent Applications edspap.20120304458 722 3 Patent patent 722.411193847656 |
| PLink |
https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edspap&AN=edspap.20120304458&custid=s6537998&authtype=sso |
| FullText |
Array
(
[Availability] => 0
)
Array ( [0] => Array ( [Url] => https://ppubs.uspto.gov/pubwebapp/external.html?q=(%2220120304458%22).pn.&db=US-PGPUB&type=ids [Name] => EDS - USPTO Patent Applications [Category] => fullText [Text] => View record in USPTO Patent Applications [MouseOverText] => View record in USPTO Patent Applications ) ) |
| Items |
Array
(
[Name] => Title
[Label] => Title
[Group] => Ti
[Data] => METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
)
Array ( [Name] => DocumentID [Label] => Document Number [Group] => Patent [Data] => 20120304458 ) Array ( [Name] => DateEntry [Label] => Publication Date [Group] => Patent [Data] => December 6, 2012 ) Array ( [Name] => DocumentID [Label] => Appl. No [Group] => Patent [Data] => 13/408597 ) Array ( [Name] => DateFiled [Label] => Application Filed [Group] => Patent [Data] => February 29, 2012 ) Array ( [Name] => Abstract [Label] => Abstract [Group] => Ab [Data] => A method for manufacturing a printed wiring board includes preparing a core substrate having first and second surfaces, forming a penetrating hole from the first surface toward the second surface of the substrate, forming first conductor on the first surface of the substrate, forming second conductor on the second surface of the substrate, and filling conductive material in the hole such that through-hole conductor connecting the first and second conductors is formed. The forming of the hole includes forming a first opening portion on the first-surface side of the substrate, a second opening portion from the bottom of the first portion toward the second surface, and a third opening portion from the bottom of the second portion toward the second surface, and the forming of the hole satisfies X2<X3≦X1 where X1, X2 and X3 represent the diameters of the first, second and third portions. ) Array ( [Name] => Author [Label] => Inventors [Group] => Patent [Data] => <searchLink fieldCode="ZA" term="%22Yamauchi%2C+Tsutomu%22">Yamauchi, Tsutomu</searchLink> (Ogaki-shi, JP); <searchLink fieldCode="ZA" term="%22Kawai%2C+Satoru%22">Kawai, Satoru</searchLink> (Ogaki-shi, JP) ) Array ( [Name] => OtherAuthors [Label] => Assignees [Group] => Patent [Data] => <searchLink fieldCode="ZS" term="%22IBIDEN+CO%2E%2C+LTD%2E%22">IBIDEN CO., LTD.</searchLink> (Ogaki-shi, JP) ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 1. A method for manufacturing a printed wiring board, comprising: preparing a core substrate having a first surface and a second surface on an opposite side of the first surface; forming a penetrating hole from the first surface of the core substrate toward the second surface; forming a first conductor on the first surface of the core substrate; forming a second conductor on the second surface of the core substrate; and filling a conductive material in the penetrating hole such that a through-hole conductor connecting the first conductor and the second conductor is formed, wherein the forming of the penetrating hole includes forming a first opening portion on a first-surface side of the core substrate, forming a second opening portion from a bottom portion of the first opening portion toward the second surface, and forming a third opening portion from a bottom portion of the second opening portion toward the second surface, and the forming of the penetrating hole satisfies X2<X3≦X1 where X1 represents a diameter of the first opening portion, X2 represents a diameter of the second opening portion, and X3 represents a diameter of the third opening portion. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 2. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the first opening portion comprises decreasing the diameter of the first opening portion from the first surface of the core substrate toward the second surface, and the forming of the second opening portion comprises decreasing the diameter of the second opening portion toward the second surface. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 3. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the penetrating hole comprises forming a bent portion at a connected area of the first opening portion and the second opening portion. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 4. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the penetrating hole comprises forming a bent portion at a connected area of the second opening portion and the third opening portion. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 5. The method for manufacturing a printed wiring board according to claim 2, wherein the forming of the penetrating hole satisfies ΔW1>ΔW2 where ΔW1 represents a ratio at which the diameter of the first opening portion decreases in a direction from the first surface of the core substrate to the second surface, and ΔW2 represents a ratio at which the diameter of the second opening portion decreases in a direction from the first surface of the core substrate to the second surface. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 6. The method for manufacturing a printed wiring board according to claim 1, further comprising: forming a first metal film on the first surface of the core substrate; and forming a second metal film on the second surface of the core substrate. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 7. The method for manufacturing a printed wiring board according to claim 6, wherein the second metal film has a fourth opening portion which is contiguous to the third opening portion, and the fourth opening portion has a diameter which is set smaller than the diameter of the second opening portion. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 8. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the first opening portion comprises forming an aperture, and the forming of the second opening portion comprises forming an aperture having an opening diameter which is set smaller than an opening diameter of the aperture for forming the first opening portion. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 9. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the second opening portion comprises forming an aperture, and the forming of the third opening portion comprises forming an aperture having an opening diameter which is set same as an opening diameter of the aperture for forming the second opening portion. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 10. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the first opening portion comprises irradiating laser, and the forming of the second opening portion comprises irradiating laser having a laser pulse width which is set longer than a laser pulse width of the laser for forming the first opening portion. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 11. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the second opening portion comprises irradiating laser, and the forming of the third opening portion comprises irradiating laser having a laser pulse width which is set same as a laser pulse width of the laser for forming the second opening portion. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 12. The method for manufacturing a printed wiring board according to claim 1, wherein the core substrate has a thickness which is set at 0.4 mm or less. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 13. The method for manufacturing a printed wiring board according to claim 1, wherein the filling of the conductive material comprises plating the penetrating hole such that the penetrating hole is filled by a plating material. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 14. The method for manufacturing a printed wiring board according to claim 1, wherein the filling of the conductive material comprises electrolytically plating the penetrating hole such that the penetrating hole is filled by an electrolytic plating material. ) Array ( [Name] => Comment [Label] => Claim [Group] => Patent [Data] => 15. The method for manufacturing a printed wiring board according to claim 1, further comprising immersing the core substrate in an electroless plating solution such that an electroless plating film is formed on the first and second surfaces of the core substrate and on an inner wall of the penetrating hole. ) Array ( [Name] => CodeClass [Label] => Current U.S. Class [Group] => Patent [Data] => 29/829 ) Array ( [Name] => CodeClass [Label] => Current International Class [Group] => Patent [Data] => 05 ) Array ( [Name] => AN [Label] => Accession Number [Group] => ID [Data] => edspap.20120304458 ) |
| RecordInfo |
Array
(
[BibEntity] => Array
(
[Languages] => Array
(
[0] => Array
(
[Text] => English
)
)
[Titles] => Array
(
[0] => Array
(
[TitleFull] => METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
[Type] => main
)
)
)
[BibRelationships] => Array
(
[HasContributorRelationships] => Array
(
[0] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Yamauchi, Tsutomu
)
)
)
[1] => Array
(
[PersonEntity] => Array
(
[Name] => Array
(
[NameFull] => Kawai, Satoru
)
)
)
)
[IsPartOfRelationships] => Array
(
[0] => Array
(
[BibEntity] => Array
(
[Dates] => Array
(
[0] => Array
(
[D] => 06
[M] => 12
[Text] => December 6, 2012
[Type] => published
[Y] => 2012
)
)
)
)
)
)
)
|
| IllustrationInfo |