Academic Journal

Debonding of coin-shaped osseointegrated implants: Coupling of experimental and numerical approaches

التفاصيل البيبلوغرافية
العنوان: Debonding of coin-shaped osseointegrated implants: Coupling of experimental and numerical approaches
المؤلفون: Hériveaux, Yoann, Le Cann, Sophie, Immel, Katharina, Vennat, Elsa, Nguyen, Vu-Hieu, Brailovski, Vladimir, Karasinski, Patrick, Sauer, Roger, A, Haiat, Guillaume
المساهمون: Laboratoire de Mécanique Paris-Saclay (LMPS), CentraleSupélec-Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS)-Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay), Laboratoire Modélisation et Simulation Multi-Echelle (MSME), Université Paris-Est Créteil Val-de-Marne - Paris 12 (UPEC UP12)-Centre National de la Recherche Scientifique (CNRS)-Université Gustave Eiffel, RWTH Aachen University = Rheinisch-Westfälische Technische Hochschule Aachen (RWTH Aachen), Ecole de Technologie Supérieure Montréal (ETS), Laboratoire Images, Signaux et Systèmes Intelligents (LISSI), Université Paris-Est Créteil Val-de-Marne - Paris 12 (UPEC UP12), Gdańsk University of Technology (GUT), Indian Institute of Technology Guwahati (IIT Guwahati), Paris Ile-de-France Region (DIM “Respore”), Paris Ile-de-France Region ("Coup de pouce" F2M Federation), CNRS (MITI interdisciplinary program), International Research Project (IRP) LAFCUS, Jülich Aachen Research Alliance Center for Simulation and Data Science (JARA-CSD) School for Simulation and Data Science (SSD)., European Project: 682001,BoneImplant, European Project: 797764,Bomb
المصدر: ISSN: 1751-6161.
بيانات النشر: CCSD
Elsevier
سنة النشر: 2023
مصطلحات موضوعية: bone-implant interface, friction, adhesion, osseointegration, finite element modeling, [SPI]Engineering Sciences [physics], [PHYS.MECA.BIOM]Physics [physics]/Mechanics [physics]/Biomechanics [physics.med-ph]
الوصف: International audience ; While cementless implants are now widely used clinically, implant debonding still occur and is difficult to anticipate. Assessing the biomechanical strength of the bone-implant interface can help improving the understanding of osseointegration phenomena and thus preventing surgical failures. A dedicated and standardized implant model was considered. The samples were tested using a mode III cleavage device to assess the mechanical strength of the bone-implant interface by combining experimental and numerical approaches. Four rough (Sa = 24.5 µm) osseointegrated coin-shaped implants were left in sheep cortical bone during 15 weeks of healing time. Each sample was experimentally rotated at 0.03°/sec until complete rupture of the interface. The maximum values of the torque were comprised between 0.48 and 0.72 N.m, while a significant increase of the normal force from 7-12 N to 31-43 N was observed during the bone-implant interface debonding, suggesting the generation of bone debris at the bone-implant interface. The experimental results were compared to an isogeometric finite element model describing the adhesion and debonding phenomena through a modified Coulomb's law, based on a varying friction coefficient to represent the transition from an unbroken to a broken bone-implant interface. A good agreement was found between numerical and experimental torques, with numerical friction coefficients decreasing from 8.93 to 1.23 during the bone-implant interface rupture, which constitutes a validation of this model to simulate the debonding of an osseointegrated bone-implant interface subjected to torsion.
نوع الوثيقة: article in journal/newspaper
اللغة: English
Relation: info:eu-repo/grantAgreement//682001/EU/European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation program (grant agreement no. 682001, project ERC Consolidator Grant 2015 BoneImplant)./BoneImplant; info:eu-repo/grantAgreement//797764/EU/MSCA-IF Project, under the European Union's Horizon 2020 research and innovation program/Bomb
DOI: 10.1016/j.jmbbm.2023.105787
الاتاحة: https://hal.science/hal-04044185
https://hal.science/hal-04044185v1/document
https://hal.science/hal-04044185v1/file/Heriveaux_et_al_2023_JMBBM_Vaccepted.pdf
https://doi.org/10.1016/j.jmbbm.2023.105787
Rights: info:eu-repo/semantics/OpenAccess
رقم الانضمام: edsbas.49D8EEF2
قاعدة البيانات: BASE
الوصف
DOI:10.1016/j.jmbbm.2023.105787