Characterization of a Wafer-Level Packaged Au−Ru/AlCu Contact for Micro-Switches
| العنوان: | Characterization of a Wafer-Level Packaged Au−Ru/AlCu Contact for Micro-Switches |
|---|---|
| المؤلفون: | Mohamed Najah, Serge Ecoffey, Tejinder Singh, Mark Ferguson, Louis-Philippe Roby, Jacques Renaud, Paul Gondcharton, Frederic A. Banville, Mohamed Boucherit, Serge A. Charlebois, Luc G. Frechette, Raafat R. Mansour, Francois Boone |
| المصدر: | Journal of Microelectromechanical Systems. 31:700-711 |
| بيانات النشر: | Institute of Electrical and Electronics Engineers (IEEE), 2022. |
| سنة النشر: | 2022 |
| مصطلحات موضوعية: | Mechanical Engineering, Electrical and Electronic Engineering |
| تدمد: | 1941-0158 1057-7157 |
| DOI: | 10.1109/jmems.2022.3172920 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::913df67bba6220a673fdf5db66218785 https://doi.org/10.1109/jmems.2022.3172920 |
| Rights: | CLOSED |
| رقم الانضمام: | edsair.doi...........913df67bba6220a673fdf5db66218785 |
| قاعدة البيانات: | OpenAIRE |
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