Effect of zinc additions on structure and properties of Sn–Ag eutectic lead-free solder alloy
| العنوان: | Effect of zinc additions on structure and properties of Sn–Ag eutectic lead-free solder alloy |
|---|---|
| المؤلفون: | Mustafa Kamal, El Said Gouda |
| المصدر: | Journal of Materials Science: Materials in Electronics. 19:81-84 |
| بيانات النشر: | Springer Science and Business Media LLC, 2007. |
| سنة النشر: | 2007 |
| مصطلحات موضوعية: | Materials science, Metallurgy, Alloy, chemistry.chemical_element, Young's modulus, Zinc, engineering.material, Condensed Matter Physics, Copper, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Contact angle, symbols.namesake, chemistry, X-ray crystallography, symbols, engineering, Wetting, Electrical and Electronic Engineering, Eutectic system |
| الوصف: | The effects of a third element, i.e., Zn in the range of 0.5–2.5 wt.%, on structure and properties of the binary Sn–Ag eutectic lead-free solder alloy were investigated. To identify the structure of the resulting alloys, X-ray diffraction analysis has been carried out. Resistivity, contact angles, Vickers microhardness and Young’s modulus have been measured. The results showed that all Zn contents were restricted in formation of Ag-Zn compound indicated by X-ray diffraction peaks, which increased continuously in the number and intensity as Zn content increased. Adding Zn up to 1.5 wt.% improved the wetting and mechanical properties. Above that, wetting angle increased due to the increase in AgZn compound, which may accumulated at the interface between solders and copper- substrate resulting a decrease in the adhesive strength. The alloy of composition Sn-3.5Ag-1.5Zn has the most improved properties between the others. |
| تدمد: | 1573-482X 0957-4522 |
| DOI: | 10.1007/s10854-007-9289-2 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::5c602955986b9be97af4de6a30a26fe6 https://doi.org/10.1007/s10854-007-9289-2 |
| Rights: | CLOSED |
| رقم الانضمام: | edsair.doi...........5c602955986b9be97af4de6a30a26fe6 |
| قاعدة البيانات: | OpenAIRE |
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